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3D semiconductor device and structure

  • US 9,887,203 B2
  • Filed: 07/28/2016
  • Issued: 02/06/2018
  • Est. Priority Date: 04/14/2009
  • Status: Active Grant
First Claim
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1. A 3D semiconductor device comprising:

  • a first layer comprising a first monocrystalline layer, said first layer comprising first logic cells;

    a second layer comprising a monocrystalline semiconductor layer, said second layer overlying said first layer, said second layer comprising second transistors,wherein said logic cells comprise a Look-Up-Table logic cell, andwherein said second transistors are aligned to said first logic cells with less than 200 nm and greater than 0.1 nm alignment error.

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