Method of manufacturing a radio frequency identification device

• US 9,887,448 B2
• Filed: 10/14/2013
• Issued: 02/06/2018
• Est. Priority Date: 06/14/2010
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Inventors: Forster, Ian J, Oelsner, Christian K, Revels, Robert, Kingston, Benjamin, Cockerell, Peter, Howard, Norman A
• Primary Examiner(s): KELLY, RAFFERTY D
• Application Number:
  US14/053,259
• Publication Number:
  US 20140034739A1
• Time in Patent Office: 1,576 Days
• Field of Search: 235492
• CPC Class Codes: B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove
• CPC Class Codes: B32B 2305/10 Fibres of continuous length
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B32B 2317/12 Paper, e.g. cardboard
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B32B 38/145 Printing
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01P 11/003 Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/5317 : Laminated device
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 428/24802 : Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/24917 : including metal layer
• CPC Class Codes: Y10T 428/2809 : including irradiated or wave energy treated component
• CPC Class Codes: Y10T 428/2817 : Heat sealable

Abstract

The present invention relates to a method of manufacturing an antenna for a radio frequency (RFID) tag. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide a microchip attachment location and to selectively tune an antenna for a particular end use application. The cutting may be performed by a laser, die cutting, stamping or combinations thereof.

Claims

1. A conductive structure for use with an RFID tag, comprising:

a metal foil layer having first and second sides, a first antenna pattern, a second antenna pattern distinct from the first antenna pattern, with the first and second patterns being in cooperative association with one another, the second antenna pattern defining at least a microprocessor attachment portion, and at least one of the first and second patterns formed by laser ablation with each of the first and second patterns extending through each of the first and second sides of the metal foil layer; and

a third antenna pattern cooperating with the first and second patterns to form a RFID antenna structure; and

a carrier layer supporting the metal foil layer in which the carrier layer is bonded by an adhesive layer to the metal foil layer wherein the adhesive layer has a plurality of registration marks to assist in alignment of both the first and second antenna patterns; and

a microprocessor attached to the microprocessor attachment portion of the second antenna pattern wherein the conductive structure is manufactured by a roll-to-roll process and the laser creates a gap that allows for direct attachment of the microprocessor with or without the use of contact extensions.

2. A conductive structure as provided in claim 1, including a third antenna pattern distinct from each of the first and second antenna patterns in cooperative association with each of the first and second antenna patterns.

3. A conductive structure as provided in claim 1, including a third antenna pattern which at least is partially coincident with one of the first and second antenna patterns.

4. A conductive structure as provided in claim 1, where the first and second antenna portions cooperate to form a RFID antenna structure.

5. A conductive structure as provided in claim 1, where each of the first and second antenna patterns are created by one of laser ablating, die cutting or cold foil processing.

6. A conductive structure as provided in claim 1, where the microprocessor attachment portion is defined in a center portion that separates a first antenna contact end and a second antenna contact end.

7. A conductive structure as provided in claim 6, wherein the microprocessor is directly electrically coupled to the antenna contact ends.

8. A conductive structure as provided in claim 1, where the foil is 100% recyclable.

9. A conductive structure as provided in claim 1, where the carrier layer is selected from the following group:

polyester films, PET films, polyimide films, fabric or cloth or paper material.

10. A conductive structure as provided in claim 1, where a reinforcement sheet is bonded to the metal foil layer.

11. A conductive structure as provide in claim 1, where the metal foil layer is aluminum, copper, silver and/or gold.

12. A conductive structure as provide in claim 1, including a third antenna pattern that provides a logo or name.

13. A conductive structure as provided in claim 1, where a strap is utilized to connect the microprocessor to the microprocessor attachment portion of the second antenna pattern.

14. A conductive structure for use with an RFID tag, comprising:

a metal foil layer having first and second sides, a first antenna pattern, a second antenna pattern distinct from the first antenna pattern, with the first and second patterns being in cooperative association with one another, the second antenna pattern defining at least a microprocessor attachment portion, and at least one of the first and second patterns formed by laser ablation with each of the first and second patterns extending through each of the first and second sides of the metal foil layer; and

a third antenna pattern cooperating with the first and second patterns to form a RFID antenna structure; and

a carrier layer supporting the metal foil layer having a plurality of registration marks printed on the carrier layer in a machine direction; and

a microprocessor attached to the microprocessor attachment portion of the second antenna pattern such that the laser creates a gap that allows for direct attachment of the microprocessor with or without the use of contact extensions.

15. A conductive structure as provided in claim 14, where, the plurality of registration marks are optical brighteners.

16. A conductive structure for use with an RFID tag, comprising:

a metal foil layer having first and second sides, a first antenna pattern, a second antenna pattern distinct from the first antenna pattern, with the first and second patterns being in cooperative association with one another, the second antenna pattern defining at least a microprocessor attachment portion, and at least one of the first and second patterns formed by laser ablation with each of the first and second patterns extending through each of the first and second sides of the metal foil layer;

a carrier layer supporting the metal foil layer in which the carrier layer is bonded by an adhesive layer to the metal foil layer; and

where the adhesive layer has a plurality of registration marks to assist in alignment of both the first and second antenna patterns; and

a microprocessor attached to the microprocessor attachment portion of the second antenna pattern wherein the conductive structure is manufactured by a roll-to-roll process.