Micromechanical gyroscope structure

• US 9,891,052 B2
• Filed: 11/17/2015
• Issued: 02/13/2018
• Est. Priority Date: 12/29/2014
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Rinki, Marcus
• Primary Examiner(s): Bolduc, David
• Application Number:
  US14/943,066
• Publication Number:
  US 20160187137A1
• Time in Patent Office: 819 Days
• CPC Class Codes: G01C 19/5712 the devices involving a micromechanical structure
• CPC Class Codes: G01C 25/00 Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass testing, calibrating or compensating compasses G01C17/38
• CPC Class Codes: G01C 25/005 initial alignment, calibration or starting-up of inertial devices

Abstract

A microelectromechanical gyroscope structure, and a method for manufacturing a microelectromechanical gyroscope structure, comprising a seismic mass and a spring structure suspending the seismic mass to a body element with a suspension structure. The spring structure allows a primary oscillation motion about a primary axis that is aligned with the plane of the seismic mass, and a secondary oscillation motion where at least part of the seismic mass moves in a second direction, perpendicular to the direction of the primary oscillation motion. The spring structure is attached to the seismic mass at both sides of the suspension structure and said spring structure is in torsional motion about the primary axis that is common with the primary oscillation motion. The structure of the gyroscope enables mechanical compensation of a quadrature error of the seismic mass by etching a compensation groove on the top face of the seismic mass.

Claims

1. A microelectromechanical gyroscope structure, comprising:

a seismic mass; and

a primary spring structure suspending the seismic mass to a body element with a suspension structure, the primary spring structure allowing a primary oscillation motion where at least part of the seismic mass rotary oscillates in a first direction about a primary axis that is aligned with the plane of the seismic mass and a secondary oscillation where at least part of the seismic mass moves in a second direction that is perpendicular to the first direction,

wherein the primary spring structure has two ends attached to the seismic mass on the opposite sides of the suspension structure and said primary spring structure is configured for torsional motion about the primary axis that is common with the primary oscillation motion, and

wherein a quadrature error of the seismic mass is mechanically compensated with at least one compensation groove disposed on the face of the seismic mass, which face is away from the body element, wherein the at least one compensation groove is positioned at a predefined distance from either end of the primary spring structure.

2. A microelectromechanical gyroscope structure according to claim 1, wherein the at least one compensation groove is formed as elongated quadrangle shape, orthogonal to the primary axis.

3. A microelectromechanical gyroscope structure according to claim 1, wherein the at least one compensation groove extends predefined distances away from the primary axis at opposite sides of the primary axis, and wherein the predefined distances are essentially equal to each other or wherein the predefined distances are different from each other.

4. A microelectromechanical gyroscope structure according to claim 1, wherein a depth of the compensation groove within the seismic mass is defined as portion of a thickness of the primary spring structure.

5. A microelectromechanical gyroscope structure according to claim 1, wherein a depth of the compensation groove is essentially half of a thickness of the primary spring structure.

6. A microelectromechanical gyroscope structure according to claim 1, wherein a depth of the compensation groove is different on different sides of the primary axis.

7. A microelectromechanical gyroscope structure according to claim 1, wherein the quadrature error is further electrically compensated using at least one electrical quadrature compensation structure placed near an end of the seismic mass away from the primary axis of the seismic mass.

8. A microelectromechanical gyroscope comprising at least two microelectromechanical gyroscope structures according to claim 1, attached to a common body element, the at least two gyroscope structures having a common primary axis.

9. The microelectromechanical gyroscope structure according to claim 1, wherein the primary spring structure is double-ended, and the parts of the primary spring structure are directly attached to the suspension structure on the opposite sides of the suspension structure.

10. A method of manufacturing a microelectromechanical gyroscope structure, the structure comprising a seismic mass and a primary spring structure suspending the seismic mass to a body element with a suspension structure to allow a primary oscillation motion where at least part of the seismic mass rotary oscillates in a first direction about a primary axis that is aligned with the plane of the seismic mass and a secondary oscillation where at least part of the seismic mass moves in a second direction that is perpendicular to the first direction, the manufacturing method comprising:

forming by at least one of etching and surface micromachining the primary spring structure that is attached to the seismic mass on the opposite sides of the suspension structure, wherein said primary spring structure is configured for torsional motion about the primary axis that is common with the primary oscillation motion; and

forming by at least one of etching and surface micromachining at least one compensation groove for mechanically compensating a quadrature error of the seismic mass, wherein the compensation groove is on the face of the seismic mass that is exposed to the main processing steps and away from the body element, wherein the at least one compensation groove is positioned at a predefined distance from either end of the primary spring structure.

11. A method for manufacturing a microelectromechanical gyroscope structure according to claim 10, wherein the compensation groove is formed as elongated quadrangle shape, orthogonal to the primary axis of the primary oscillation motion.

12. A method for manufacturing a microelectromechanical gyroscope structure according to claim 10, wherein the compensation groove extends predefined distances away from the primary axis at opposite sides of the primary axis, wherein the predefined distances are essentially equal to each other or wherein the predefined distances are different from each other.

13. A method for manufacturing a microelectromechanical gyroscope structure according to claim 10, wherein the depth of the compensation groove within the seismic mass is defined as portion of a thickness of the primary spring structure.

14. A method for manufacturing a microelectromechanical gyroscope structure according to claim 10, wherein a depth of the compensation groove is essentially half of a thickness of the primary spring structure.

15. A method for manufacturing a microelectromechanical gyroscope structure according to claim 10, wherein a depth of the compensation groove is different on different sides of the primary axis.

16. A method for manufacturing a microelectromechanical gyroscope structure according to claim 10, wherein the compensation groove is formed by at least one of etching and surface micromachining with a process performed only on the face of the seismic mass that is away from the body element.

17. A method for manufacturing a microelectromechanical gyroscope structure according to claim 10, further comprising etching of the compensation groove, said etching comprising at least one common etching phase with the etching of the seismic mass structure or the primary spring structure or a sensing comb structure or an electrical compensation structure.

18. A method for manufacturing a micromechanical gyroscope, said method comprising forming by at least one of etching and surface micromachining at least two microelectromechanical gyroscope structures according to the method of claim 10, wherein said gyroscope structures are attached to the same body element and have a common primary axis.