×

Microelectronic packages having split gyroscope structures and methods for the fabrication thereof

  • US 9,891,244 B2
  • Filed: 08/15/2014
  • Issued: 02/13/2018
  • Est. Priority Date: 08/15/2014
  • Status: Active Grant
First Claim
Patent Images

1. A microelectronic package, comprising:

  • a first Microelectromechanical Systems (MEMS) die having a first MEMS gyroscope structure and a frontside on which the first MEMS gyroscope structure is formed;

    a second MEMS die having a second MEMS gyroscope structure thereon and positioned in a stacked relationship with the first MEMS die, the first and second MEMS gyroscope structures overlapping as taken along an axis orthogonal to the frontside of the first MEMS die;

    a first hermetic cavity enclosing the first MEMS gyroscope structure;

    a second hermetic cavity enclosing the second MEMS gyroscope structure and fluidly coupled to the first hermetic cavity;

    a vent hole fluidly coupling the first and second hermetic cavities and formed through the first MEMS die;

    a cap piece sealingly bonded to the first MEMS die opposite the second MEMS die; and

    a MEMS accelerometer structure formed on the frontside of the first MEMS die at a location adjacent the first MEMS gyroscope structure, the MEMS accelerometer structure further overlapping with the second MEMS gyroscope structure as taken along an axis orthogonal to the frontside of the first MEMS die.

View all claims
  • 15 Assignments
Timeline View
Assignment View
    ×
    ×