Test circuit and method
First Claim
1. A method comprising:
- transmitting first forced signals from a plurality of first antennas of a planar test fixture to a plurality of second antennas of a first wafer layer of an under-test device, wherein each of the second antennas positionally corresponds to one of the first antennas;
receiving first feedback signals from the second antennas by the first antennas; and
determining at least a relationship of distances between the first antennas and the second antennas according to first received power of the first feedback signals, to determine a first surface warping condition of the under-test device,wherein the distances between the first antennas and the second antennas are determined to be different on condition that the first received power are different.
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Accused Products
Abstract
A method is disclosed that includes the operations outlined below. For a plurality of dies on a test fixture, an antenna distance between each of first antennas of one of the dies and every one of first antennas of the other dies is determined. The dies are categorized into die groups, wherein the antenna distance between each of the first antennas of one of the dies in one of the die groups and every one of the first antennas of the other dies in the same one of the die groups is larger than an interference threshold. Test processes are sequentially performed on the die groups. Each of the test processes is performed according to signal transmissions between the first antennas and second antennas of the under-test device each positionally corresponds to one of the first antennas.
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Citations
20 Claims
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1. A method comprising:
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transmitting first forced signals from a plurality of first antennas of a planar test fixture to a plurality of second antennas of a first wafer layer of an under-test device, wherein each of the second antennas positionally corresponds to one of the first antennas; receiving first feedback signals from the second antennas by the first antennas; and determining at least a relationship of distances between the first antennas and the second antennas according to first received power of the first feedback signals, to determine a first surface warping condition of the under-test device, wherein the distances between the first antennas and the second antennas are determined to be different on condition that the first received power are different. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method comprising:
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transmitting first forced signals from a plurality of first antennas of a planar test fixture to a plurality of second antennas of a first wafer layer of an under-test device, wherein each of the second antennas positionally corresponds to one of the first antennas; receiving first feedback signals from the second antennas by the first antennas; and determining one of a first surface warping condition of the under-test device and a position of an aiming antenna of the first antennas according to the first feedback signals, wherein at least a relationship of distances between the first antennas and the second antennas is determined, according to the first feedback signals, to determine the first surface warping condition, wherein the distances between the first antennas and the second antennas are determined to be different on condition that first received power of the first feedback signals are different. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification