Wireless sensor for thermal property with thermal source
First Claim
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1. A radio frequency identification (RFID) tag adapted to wirelessly communicate with a remote transceiver, comprising:
- a substrate;
an antenna disposed on the substrate;
an electronic circuit disposed on the substrate and electrically coupled to the antenna, the electronic circuit comprising one or more of a transistor, a diode, a resistor and a capacitor, wherein an integrated circuit (IC) comprises the electronic circuit;
a heating element electrically coupled to the electronic circuit for heating a target area;
a sensing element thermally coupled to the heating element for sensing a temperature of the heating element, such that when the heating element is thermally coupled to the target area, the RFID tag wirelessly receives a first power having a first form from a transceiver, the electronic circuit transforms the first power to a second power having a second form different from the first form and delivers the second power to the heating element, the sensing element senses a time variation of the heating element temperature, and the RFID tag wirelessly transmits to the transceiver a thermal characteristic of the target area based on the sensed time variation of the heating element temperature; and
a thermally conductive heat spreading layer disposed on a major surface of the IC and adapted to substantially uniformly distribute heat from the heating element across the target area.
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Abstract
A radio frequency (RF) sensing device in an assembly is adapted to wirelessly communicate with a remote transceiver. The sensing device includes a substrate; an antenna disposed on the substrate; an electronic circuit disposed on the substrate and electrically coupled to the antenna; a heating element electrically coupled to the electronic circuit for heating a target area; and a sensing element thermally coupled to the heating element for sensing a temperature of the heating element. The RF sensing device is configured to wirelessly receive a power and provides the power to the heating element.
38 Citations
13 Claims
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1. A radio frequency identification (RFID) tag adapted to wirelessly communicate with a remote transceiver, comprising:
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a substrate; an antenna disposed on the substrate; an electronic circuit disposed on the substrate and electrically coupled to the antenna, the electronic circuit comprising one or more of a transistor, a diode, a resistor and a capacitor, wherein an integrated circuit (IC) comprises the electronic circuit; a heating element electrically coupled to the electronic circuit for heating a target area; a sensing element thermally coupled to the heating element for sensing a temperature of the heating element, such that when the heating element is thermally coupled to the target area, the RFID tag wirelessly receives a first power having a first form from a transceiver, the electronic circuit transforms the first power to a second power having a second form different from the first form and delivers the second power to the heating element, the sensing element senses a time variation of the heating element temperature, and the RFID tag wirelessly transmits to the transceiver a thermal characteristic of the target area based on the sensed time variation of the heating element temperature; and a thermally conductive heat spreading layer disposed on a major surface of the IC and adapted to substantially uniformly distribute heat from the heating element across the target area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A radio frequency identification (RFID) tag adapted to wirelessly communicate with a remote transceiver, comprising:
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a substrate; a power source disposed on the substrate; an antenna disposed on the substrate; an electronic circuit disposed on the substrate and electrically coupled to the antenna and the power source, the electronic circuit comprising one or more of a transistor, a diode, a resistor and a capacitor, wherein an integrated circuit (IC) comprises the electronic circuit; a heating element electrically coupled to the electronic circuit and the power source for heating a target area; a sensing element thermally coupled to the heating element for sensing a temperature of the heating element, such that when the heating element is thermally coupled to the target area, the power source delivers a heating power to the heating element, the sensing element senses a time variation of the heating element temperature, and the RFID tag wirelessly transmits to a transceiver a thermal characteristic of the target area based on the sensed time variation of the heating element temperature; and a thermally conductive heat spreading layer disposed on a major surface of the IC and adapted to substantially uniformly distribute heat from the heating element across the target area. - View Dependent Claims (10, 11, 12)
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13. A radio frequency identification (RFID) tag adapted to wirelessly communicate with a remote transceiver, comprising:
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a substrate; an antenna disposed on the substrate; an electronic circuit disposed on the substrate and electrically coupled to the antenna, the electronic circuit comprising one or more of a transistor, a diode, a resistor and a capacitor, wherein an integrated circuit (IC) comprises the electronic circuit; a heating element electrically coupled to the electronic circuit for heating a target area; a sensing element thermally coupled to the heating element for sensing a temperature of the heating element, such that when the heating element is thermally coupled to the target area, the RFID tag wirelessly receives a first power having a first form from a transceiver, the electronic circuit transforms the first power to a second power having a second form different from the first form and delivers the second power to the heating element, the sensing element senses a time variation of the heating element temperature, and the RFID tag wirelessly transmits to the transceiver the sensed time variation of the heating element temperature; and a thermally conductive heat spreading layer disposed on a major surface of the IC and adapted to substantially uniformly distribute heat from the heating element across the target area.
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Specification