Diodes offering asymmetric stability during fluidic assembly

• US 9,892,944 B2
• Filed: 06/23/2016
• Issued: 02/13/2018
• Est. Priority Date: 06/23/2016
• Status: Active Grant

• Current Assignee: Elux Inc.
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Schuele, Paul John, Heine, David Robert, Crowder, Mark Albert, Garner, Sean Mathew, Zhan, Changqing, Shinde, Avinash Tukaram, Sasaki, Kenji Alexander, Ulmer, Kurt Michael
• Primary Examiner(s): Gebreyesus, Yosef
• Application Number:
  US15/190,813
• Publication Number:
  US 20170372927A1
• Time in Patent Office: 600 Days
• CPC Class Codes: H01L 21/67121 Apparatus for making assemblies not otherwise provided for, e.g. package constructions
• CPC Class Codes: H01L 21/67333 Trays for chips magazine for components H05K13/0084
• CPC Class Codes: H01L 2224/95001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 2224/95123 by applying a pressurised fluid flow, e.g. liquid or gas flow
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating

Abstract

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Claims

1. A fluidic assembly system, the system comprising:

a substrate including a plurality of wells;

a suspension including a carrier liquid and a plurality of post enhanced diodes each including a non-metal post extending from a diode structure;

wherein the diode structure includes a bottom surface formed at least in part of a first electrically conductive material and a top surface formed at least in part of a second electrically conductive material; and

wherein a bottom surface of the non-metal post is disposed over the top surface of the of the diode structure such that the second electrically conductive material of the top surface of the diode structure extends along a plane under and beyond the bottom surface of the non-metal post and is between the non-metal post and the first electrically conductive material.

2. The fluidic assembly system of claim 1, the system further comprising:

a suspension movement device operable to move the suspension over the substrate such that a portion of the plurality of post enhanced diodes deposit in respective ones of the plurality of wells.

3. The fluidic assembly system of claim 1, wherein the diode structure of the post enhanced diodes further includes:

a first electrical contact formed of a third electrically conductive material disposed on the top surface and unconnected to the non-metal post, wherein the third electrically conductive material is different from the first electrically conducive material, and wherein the first electrical contact is configured to conduct charge to the first electrically conductive material; and

a second electrical contact configured to conduct charge to the second electrically conductive material.

4. The fluidic assembly system of claim 1, wherein each of the plurality of wells includes a through hole via extending through the substrate from the bottom of the respective well, and wherein a width of a surface of the non-metal post substantially parallel to the top surface of the diode structure is greater than a width of the through hole via.

5. The fluidic assembly system of claim 1, wherein each of the plurality of wells includes a through hole via extending through the substrate from the bottom of the respective well, and wherein the through hole via is off center from a circular shaped bottom of the respective well.

6. The fluidic assembly system of claim 1, wherein the diode structure includes a bottom surface, and wherein a maximum width of the bottom surface is less than a maximum width of each of the plurality of wells.

7. The fluidic assembly system of claim 1, wherein an electrical contact is formed on an interior surface of each of the plurality of wells.

8. The fluidic assembly system of claim 1, wherein an orientation of each of the plurality of post enhanced diodes where the non-metal post extends away from the substrate is a non-inverted orientation, wherein an orientation of each of the plurality of post enhanced diodes where the non-metal post extends toward the substrate is an inverted orientation, and wherein one of the plurality of post enhanced diodes deposited in a respective well is more mechanically stable in the non-inverted orientation than in the inverted orientation.

9. The fluidic assembly system of claim 1, wherein an orientation of each of the plurality of post enhanced diodes where the non-metal post extends away from the substrate is a non-inverted orientation, wherein an orientation of each of the plurality of post enhanced diodes where the non-metal post extends toward the substrate is an inverted orientation, and wherein an orientation of one of the plurality of post enhanced diodes in contact with a surface of the substrate is more mechanically stable in the non-inverted orientation than in the inverted orientation.

10. The fluidic assembly system of claim 1, wherein an orientation of each of the plurality of post enhanced diodes where the non-metal post extends away from the substrate is a non-inverted orientation, wherein an orientation of each of the plurality of post enhanced diodes where the non-metal post extends toward the substrate is an inverted orientation, and wherein the substrate further includes:

at least one groove configured such that an orientation of one of the plurality of post enhanced diodes traversing the groove is more mechanically stable in the non-inverted orientation than in the inverted orientation.

11. The fluidic assembly system of claim 10, wherein the groove extends into the substrate with a leading edge exhibiting a slope greater than a trailing edge, and wherein upon moving the suspension over the substrate one of the post enhanced diodes crosses the trailing edge before crossing the leading edge.

12. The fluidic assembly system of claim 10, wherein a depth of the groove into the substrate is less than a distance from an edge of the top surface of the diode structure to an edge of the non-metal post.

13. The fluidic assembly system of claim 10, wherein a width of the groove at a surface of the substrate is less than a distance from an edge of the top surface of the diode structure to an edge of the non-metal post.

14. The fluidic assembly system of claim 1, wherein a pair of the first electrically conductive material and the second electrically are either:

a p-doped semiconductor material and an n-doped semiconductor material, respectively;

or an n-doped semiconductor material and a p-doped semiconductor material, respectively.

15. A post enhanced diode comprising:

a planar top surface formed at least in part of a first electrically conductive material;

a planar bottom surface formed at least in part of a second electrically conductive material;

a post extending from the planar top surface, wherein the planar top surface is between the post and the planar bottom surface;

a first electrical contact formed of a third electrically conductive material disposed on the planar top surface and unconnected to the post, wherein the third electrically conductive material is different from the first electrically conducive material, and wherein the first electrical contact is configured to conduct charge to the first electrically conductive material; and

a second electrical contact configured to conduct charge to the second electrically conductive material.

16. The post enhanced diode of claim 15, wherein the top surface exhibits a first maximum width, wherein a surface of the post that is substantially parallel to the top surface exhibits a second maximum width, and wherein the first maximum width is at least two times the second maximum width.

17. The post enhanced diode of claim 15, wherein the post exhibits a height extending from the top surface to the surface of the post that is substantially parallel to the top surface, wherein a distance between the top surface and the bottom surface is a thickness, and wherein the thickness-to-height ratio is in a range of 1:

0.6 to 1;

4.

18. The post enhanced diode of claim 15, wherein the top surface exhibits a maximum width, wherein a distance between the top surface and the bottom surface is a thickness, and wherein the maximum width-to-thickness aspect ratio is in a range of 5:

1 to 50;

1.

19. The post enhanced diode of claim 15, wherein the post is the first electrical contact.

20. The post enhanced diode of claim 15, wherein the post is formed of an insulator material.

21. The post enhanced diode of claim 15, wherein the top surface has a shape selected from a group consisting of:

a circle, a polygon, and an ellipse.

22. The post enhanced diode of claim 15, wherein the top surface has a hexagonal shape.

23. The post enhanced diode of claim 15, wherein a surface of the post that is substantially parallel to the top surface has a shape selected from a group consisting of:

a circle, a polygon, and an ellipse.

24. The post enhanced diode of claim 15, wherein the post is formed of a third conductive material.

25. The post enhanced diode of claim 24, wherein the third conductive material is the same as the first conductive material.

26. The post enhanced diode of claim 25, wherein the first conductive material is a p-doped semiconductor material, and wherein the second conductive material is an n-doped semiconductor material.

27. The post enhanced diode of claim 25, wherein the first conductive material is an n-doped semiconductor material, and wherein the second conductive material is a p-doped semiconductor material.

28. The post enhanced diode of claim 15, wherein the post is a non-metal post.

29. A fluidic assembly system, the system comprising:

a substrate including a plurality of wells;

a suspension including a carrier liquid and a plurality of post enhanced diodes each including a post extending from a top surface of a diode structure; and

wherein an orientation of each of the plurality of post enhanced diodes where the post extends away from the substrate is a non-inverted orientation, wherein an orientation of each of the plurality of post enhanced diodes where the post extends toward the substrate is an inverted orientation, and wherein one of the plurality of post enhanced diodes deposited in a respective well is more mechanically stable in the non-inverted orientation than in the inverted orientation.

30. The fluidic assembly system of claim 29, wherein the substrate further includes:

at least one groove configured such that an orientation of one of the plurality of post enhanced diodes traversing the groove is more mechanically stable in the non-inverted orientation than in the inverted orientation.

31. The fluidic assembly system of claim 30, wherein the groove extends into the substrate with a leading edge exhibiting a slope greater than a trailing edge, and wherein upon moving the suspension over the substrate one of the post enhanced diodes crosses the trailing edge before crossing the leading edge.

32. The fluidic assembly system of claim 30, wherein a depth of the groove into the substrate is less than a distance from an edge of the top surface of the diode structure to an edge of the post.

33. The fluidic assembly system of claim 30, wherein a width of the groove at a surface of the substrate is less than a distance from an edge of the top surface of the diode structure to an edge of the post.

34. A fluidic assembly system, the system comprising:

a substrate including a plurality of wells;

a suspension including a carrier liquid and a plurality of post enhanced diodes each including a post extending from a top surface of a diode structure; and

wherein an orientation of each of the plurality of post enhanced diodes where the post extends away from the substrate is a non-inverted orientation, wherein an orientation of each of the plurality of post enhanced diodes where the post extends toward the substrate is an inverted orientation, and wherein a combination of a size of the post, a size of the diode structure, and a configuration of the well results in a first portion of the top surface of the diode structure extending out of a respective well when one of the plurality of post enhanced diodes deposited in the respective well in the inverted orientation with a portion of the post and a second portion of the top surface of the diode structure in contact with a bottom of the respective well.

35. The fluidic assembly system of claim 34, wherein an electrical contact is formed on an interior surface of each of the plurality of wells.

36. The fluidic assembly system of claim 34, wherein the substrate further includes:

at least one groove configured such that an orientation of one of the plurality of post enhanced diodes traversing the groove is more mechanically stable in the non-inverted orientation than in the inverted orientation.

37. The fluidic assembly system of claim 36, wherein the groove extends into the substrate with a leading edge exhibiting a slope greater than a trailing edge, and wherein upon moving the suspension over the substrate one of the post enhanced diodes crosses the trailing edge before crossing the leading edge.

38. The fluidic assembly system of claim 36, wherein a depth of the groove into the substrate is less than a distance from an edge of the top surface of the diode structure to an edge of the post.

39. The fluidic assembly system of claim 36, wherein a width of the groove at a surface of the substrate is less than a distance from an edge of the top surface of the diode structure to an edge of the post.