Diodes offering asymmetric stability during fluidic assembly
First Claim
Patent Images
1. A fluidic assembly system, the system comprising:
- a substrate including a plurality of wells;
a suspension including a carrier liquid and a plurality of post enhanced diodes each including a non-metal post extending from a diode structure;
wherein the diode structure includes a bottom surface formed at least in part of a first electrically conductive material and a top surface formed at least in part of a second electrically conductive material; and
wherein a bottom surface of the non-metal post is disposed over the top surface of the of the diode structure such that the second electrically conductive material of the top surface of the diode structure extends along a plane under and beyond the bottom surface of the non-metal post and is between the non-metal post and the first electrically conductive material.
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Abstract
Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
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Citations
39 Claims
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1. A fluidic assembly system, the system comprising:
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a substrate including a plurality of wells; a suspension including a carrier liquid and a plurality of post enhanced diodes each including a non-metal post extending from a diode structure; wherein the diode structure includes a bottom surface formed at least in part of a first electrically conductive material and a top surface formed at least in part of a second electrically conductive material; and wherein a bottom surface of the non-metal post is disposed over the top surface of the of the diode structure such that the second electrically conductive material of the top surface of the diode structure extends along a plane under and beyond the bottom surface of the non-metal post and is between the non-metal post and the first electrically conductive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A post enhanced diode comprising:
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a planar top surface formed at least in part of a first electrically conductive material; a planar bottom surface formed at least in part of a second electrically conductive material; a post extending from the planar top surface, wherein the planar top surface is between the post and the planar bottom surface; a first electrical contact formed of a third electrically conductive material disposed on the planar top surface and unconnected to the post, wherein the third electrically conductive material is different from the first electrically conducive material, and wherein the first electrical contact is configured to conduct charge to the first electrically conductive material; and a second electrical contact configured to conduct charge to the second electrically conductive material. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A fluidic assembly system, the system comprising:
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a substrate including a plurality of wells; a suspension including a carrier liquid and a plurality of post enhanced diodes each including a post extending from a top surface of a diode structure; and wherein an orientation of each of the plurality of post enhanced diodes where the post extends away from the substrate is a non-inverted orientation, wherein an orientation of each of the plurality of post enhanced diodes where the post extends toward the substrate is an inverted orientation, and wherein one of the plurality of post enhanced diodes deposited in a respective well is more mechanically stable in the non-inverted orientation than in the inverted orientation. - View Dependent Claims (30, 31, 32, 33)
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34. A fluidic assembly system, the system comprising:
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a substrate including a plurality of wells; a suspension including a carrier liquid and a plurality of post enhanced diodes each including a post extending from a top surface of a diode structure; and wherein an orientation of each of the plurality of post enhanced diodes where the post extends away from the substrate is a non-inverted orientation, wherein an orientation of each of the plurality of post enhanced diodes where the post extends toward the substrate is an inverted orientation, and wherein a combination of a size of the post, a size of the diode structure, and a configuration of the well results in a first portion of the top surface of the diode structure extending out of a respective well when one of the plurality of post enhanced diodes deposited in the respective well in the inverted orientation with a portion of the post and a second portion of the top surface of the diode structure in contact with a bottom of the respective well. - View Dependent Claims (35, 36, 37, 38, 39)
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Specification