Packaged semiconductor devices with multi-use input contacts and related methods

• US 9,893,007 B2
• Filed: 04/27/2016
• Issued: 02/13/2018
• Est. Priority Date: 04/27/2016
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Inventors: Iyoshi, Kentaro
• Primary Examiner(s): Duda, Rina
• Application Number:
  US15/139,649
• Publication Number:
  US 20170317021A1
• Time in Patent Office: 657 Days
• Field of Search: 318599, 318811, 318569, 318600, 318461, 3888075
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H02P 6/08 Arrangements for controlling the speed or torque of a single motor H02P6/10, H02P6/28 take precedence
• CPC Class Codes: H03M 1/12 Analogue/digital converters H03M1/001 – H03M1/10 take precedence
• CPC Class Codes: H03M 11/24 using analogue means , e.g. by coding the states of multiple switches into a single multi-level analogue signal or by indicating the type of a device using the voltage level at a specific tap of a resistive divider

Abstract

A semiconductor device includes a first contact receiving a first voltage, a second contact receiving a second voltage, one or more comparing elements comparing the first and second voltages, and one or more setting elements setting one or more parameters of the device in response to a comparison of the first and second voltages. When the first voltage is greater than the second voltage the setting element selects the first voltage as a high voltage, the second voltage as a low voltage, and sets a mode signal to a first value. When the second voltage is greater than the first voltage the setting element selects the first voltage as the low voltage, the second voltage as the high voltage, and sets the mode signal to a second value. The first and second values alter a condition of an electronic component coupled with the device between a first and second state.

Claims

1. A packaged semiconductor device, comprising:

a first input contact configured to receive a first input voltage;

a second input contact configured to receive a second input voltage;

one or more comparing elements configured to compare the first input voltage with the second input voltage, and;

one or more setting elements configured to set one or more operating parameters of the device in response to a comparison of the first input voltage and the second input voltage by the one or more comparing elements;

wherein, in response to the first input voltage being greater than the second input voltage, the one or more setting elements are configured to select the first input voltage as a high input voltage, select the second input voltage as a low input voltage, and set a mode signal of the device to a first value;

wherein, in response to the second input voltage being greater than the first input voltage, the one or more setting elements are configured to select the first input voltage as the low input voltage, select the second input voltage as the high input voltage, and set the mode signal to a second value;

wherein the first value and the second value of the mode signal are configured to alter an operating condition of an electronic component coupled with the device between a first state and a second state, respectively;

wherein the packaged semiconductor device is configured to set the high input voltage, the low input voltage, and the mode signal using only the first input contact and the second input contact; and

wherein the high input voltage, the low input voltage, and the mode signal are supplied to the electronic component.

2. The device of claim 1, wherein the one or more comparing elements comprises a comparator.

3. The device of claim 1, wherein the one or more setting elements comprises one or more switches and one or more inverters.

4. The device of claim 1, wherein the one or more setting elements comprises one or more multiplexers.

5. The device of claim 1, wherein the device further comprises one or more analog-to-digital converters (ADCs) to convert the high input voltage into a high input digital signal and the low input voltage into a low input digital signal.

6. The device of claim 1, wherein the first input contact and the second input contact are each coupled with a first multiplexer, the first multiplexer is coupled with an analog-to-digital converter (ADC), the ADC is coupled with a register, and the register is coupled with a comparator and with a second multiplexer and a third multiplexer, the second multiplexer and third multiplexer being controlled by an output of the comparator.

7. The device of claim 1, wherein the device comprises a fan controller comprising a third input contact, configured to be coupled with a power supply, and an output contact configured to output an output voltage to power a fan, wherein the high input voltage is configured to set a high value for the output voltage corresponding with a high fan speed, wherein the low input voltage is configured to set a low value for the output voltage corresponding with a low fan speed, and wherein the mode signal is configured to determine whether the fan stops in response to the output voltage dropping below the low value.

8. A packaged semiconductor device, comprising:

a first input contact configured to receive a first input voltage;

a second input contact configured to receive a second input voltage;

a third input contact configured to receive a third input voltage;

one or more comparing elements configured to compare the first input voltage, the second input voltage, and the third input voltage, and;

one or more setting elements configured to, in response to a comparison of the input voltages by the one or more comparing elements, select one of the input voltages as a high input voltage, select another of the input voltages as a medium input voltage, and select another of the input voltages as a low input voltage;

wherein the one or more setting elements are further configured to vary values of one or more mode signals of the device in response to which of the input voltages is selected as the high input voltage, which of the input voltages is selected as the medium input voltage, and which of the input voltages is selected as the low input voltage;

wherein the values of the one or more mode signals are configured to alter an operating condition of an electronic component coupled with the device between one or more states;

wherein the packaged semiconductor device is configured to set the high input voltage, the medium input voltage, the low input voltage, and the one or more mode signals using only the first input contact, the second input contact, and the third input contact; and

wherein the high input voltage, the medium input voltage, the low input voltage, and the one or more mode signals are supplied to the electronic component.

9. The device of claim 8, wherein the one or more mode signals comprises three mode signals, and wherein the one or more setting elements are configured to vary the three mode signals between two values each in response to which of the input voltages is selected as the high input voltage, which of the input voltages is selected as the medium input voltage, and which of the input voltages is selected as the low input voltage.

10. The device of claim 8, wherein the one or more setting elements are configured to vary one of the one or more mode signals between six values in response to which of the input voltages is selected as the high input voltage, which of the input voltages is selected as the medium input voltage, and which of the input voltages is selected as the low input voltage.

11. The device of claim 8, wherein one or more analog-to-digital converters (ADCs) are coupled between the one or more comparing elements and the input voltages, and wherein the one or more comparing elements compare digital values of the input voltages.

12. The device of claim 8, wherein the one or more comparing elements comprises three comparators, wherein each of the first input contact, the second input contact and the third input contact is coupled with inputs of two of the three comparators, wherein each input contact is further coupled with inputs of three multiplexers, wherein a decoder is configured to control the three multiplexers in response to receiving outputs of the three comparators, and wherein the input voltages are coupled with one or more analog-to-digital converters.

13. The device of claim 8, wherein each of the input voltages is coupled with an input of a multiplexer, an output of the multiplexer is coupled with an analog-to-digital converter (ADC), an output of the ADC is coupled with a first register to store ADC output values therein, a controller is coupled with the multiplexer and is configured to control the multiplexer, the controller is configured to compare the stored ADC output values from the first register to select the high input voltage, the medium input voltage, the low input voltage, and one or more of the values of the one or more mode signals, and wherein the controller is configured to store values associated with the high input voltage, the medium input voltage, the low input voltage, and the one or more mode signals in a second register.

14. A method of use of a packaged semiconductor device, comprising:

applying a first input voltage to a first input contact;

applying a second input voltage to a second input contact;

comparing the first input voltage with the second input voltage using one or more comparing elements of the device;

using one or more setting elements, selecting one of the input voltages as a high input voltage and another of the input voltages as a low input voltage;

in response to the first input voltage being selected as the high input voltage, setting a mode signal, using the one or more setting elements, to a first value, and;

in response to the second input voltage being selected as the high input voltage, setting the mode signal, using the one or more setting elements, to a second value different from the first value;

wherein selecting the high input voltage and the low input voltage and setting the mode signal to a first value and setting the mode signal to a second value is done using only the first input contact and the second input contact; and

wherein the high input voltage, the low input voltage, and the mode signal are supplied to the electronic component.

15. The method of claim 14, further comprising setting three operating parameters of the device using no input contacts except the first input contact and the second input contact, wherein the three operating parameters are configured to alter an operating condition of an electronic component coupled with the device between one or more states.

16. The method of claim 14, further comprising applying a third input voltage to a third input contact, the third input voltage comprising one of the input voltages, comparing the third input voltage with the first input voltage and the second input voltage using the one or more comparing elements and, using the one or more setting elements, selecting one of the input voltages as a medium input voltage.

17. The method of claim 16, further comprising varying, using the one or more setting elements, multiple mode signals of the device, between at least two values each, in response to which of the input voltages is selected as the high input voltage, which of the input voltages is selected as the medium input voltage, and which of the input voltages is selected as the low input voltage.

18. The method of claim 16, further comprising varying, using the one or more setting elements, the mode signal between at least three values in response to which of the input voltages is selected as the high input voltage, which of the input voltages is selected as the medium input voltage, and which of the input voltages is selected as the low input voltage.