Semiconductor device
First Claim
1. A semiconductor device comprising:
- a substrate comprising a wiring layer;
a first conductive shielding layer disposed on the substrate and electrically insulated from the wiring layer, the first conductive shielding layer comprising a first bonding surface and a first end surface extending from the first bonding surface;
a semiconductor chip disposed on the first conductive shielding layer;
a molding member disposed over the first conductive shielding layer to cover the semiconductor chip;
a second conductive shielding layer disposed over the first conductive shielding layer and the molding member, the second conductive shielding layer comprising a second bonding surface and a second end surface extending from the second bonding surface; and
a bonding portion disposed between the first and second bonding surfaces, the bonding portion comprising a top surface and a bottom surface opposite to the top surface,wherein the bottom surface of the bonding portion contacts the first bonding surface to form a first contact surface,wherein the top surface of the bonding portion contacts the second bonding surface to form a second contact surface, andwherein an area of the second contact surface is larger than an area of the second end surface.
1 Assignment
0 Petitions
Accused Products
Abstract
In one embodiment, a semiconductor device comprising, a substrate comprising a wiring layer, a first conductive shielding layer disposed on the substrate and electrically isolated from the wiring layer, the first conductive shielding layer comprising a first bonding surface and a first end surface extending from the first bonding surface, a semiconductor chip disposed on the first conductive shielding layer, a molding member disposed over the first conductive shielding layer to cover the semiconductor chip, a second conductive shielding layer disposed over the first conductive shielding layer and the molding member, the second conductive shielding layer comprising a second bonding surface and a second end surface extending from the second bonding surface, and a bonding portion disposed between the first and second bonding surfaces, the bonding portion comprising a top surface and a bottom surface opposite to the top surface. The bottom surface of the bonding portion contacts the first bonding surface to form a first contact surface. The top surface of the bonding portion contacts the second bonding surface to form a second contact surface. An area of the second contact surface is larger than an area of the second end surface.
-
Citations
10 Claims
-
1. A semiconductor device comprising:
-
a substrate comprising a wiring layer; a first conductive shielding layer disposed on the substrate and electrically insulated from the wiring layer, the first conductive shielding layer comprising a first bonding surface and a first end surface extending from the first bonding surface; a semiconductor chip disposed on the first conductive shielding layer; a molding member disposed over the first conductive shielding layer to cover the semiconductor chip; a second conductive shielding layer disposed over the first conductive shielding layer and the molding member, the second conductive shielding layer comprising a second bonding surface and a second end surface extending from the second bonding surface; and a bonding portion disposed between the first and second bonding surfaces, the bonding portion comprising a top surface and a bottom surface opposite to the top surface, wherein the bottom surface of the bonding portion contacts the first bonding surface to form a first contact surface, wherein the top surface of the bonding portion contacts the second bonding surface to form a second contact surface, and wherein an area of the second contact surface is larger than an area of the second end surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
Specification