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3D capacitor and method of manufacturing same

  • US 9,893,163 B2
  • Filed: 11/04/2011
  • Issued: 02/13/2018
  • Est. Priority Date: 11/04/2011
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a three-dimensional (3D) capacitor comprising;

    a substrate including a top surface and a fin structure, the fin structure including first and second portions, the first portion of the fin structure including a first fin and the second portion of the fin structure including a second fin, each of the first and second fins including a fin-top surfaces and a sidewall surface;

    a low-resistance layer on the top surface of the substrate, the fin-top surfaces of the first and second fins, and sidewall surfaces of the first and second fins;

    an insulation material disposed over a first portion of the low-resistance layer over the top surface of the substrate between the first fin and the second fin;

    a dielectric layer disposed over a second portion of the low-resistance layer, and over the insulation material;

    a first electrode disposed over the first fin, the first electrode being in direct contact with the low-resistance layer on the fin-top surface of the first fin; and

    a second electrode disposed over the dielectric layer that is disposed over the second fin,wherein the first and second portions of the fin structure are different.

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