Methods of manufacturing structures having concealed components

• US 9,896,777 B2
• Filed: 10/27/2016
• Issued: 02/20/2018
• Est. Priority Date: 10/30/2015
• Status: Expired due to Fees

• Current Assignee: Essential Products, Inc.
• Original Assignee: Essential Products, Inc.
• Inventors: Evans, V, David John, Jiang, Xinrui, Rubin, Andrew E., Hershenson, Matthew, Miao, Xiaoyu, Tate, Joseph Anthony, Gagne-Keats, Jason Sean, Zavin, Rebecca Schultz
• Primary Examiner(s): Lu, Jiong-Ping
• Application Number:
  US15/336,701
• Publication Number:
  US 20170121840A1
• Time in Patent Office: 481 Days
• CPC Class Codes: B32B 15/00 Layered products comprising a layer of metal
• CPC Class Codes: B32B 18/00 Layered products essentially comprising ceramics, e.g. refractory products
• CPC Class Codes: B32B 2255/24 Organic non-macromolecular coating
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/206 Insulating
• CPC Class Codes: B32B 2311/18 Titanium
• CPC Class Codes: B32B 2315/02 Ceramics
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C25D 11/02 Anodisation
• CPC Class Codes: C25D 11/026 Anodisation with spark discharge
• CPC Class Codes: C25D 11/04 of aluminium or alloys based thereon
• CPC Class Codes: C25D 11/18 After-treatment, e.g. pore-sealing
• CPC Class Codes: C25D 11/26 of refractory metals or alloys based thereon
• CPC Class Codes: C25F 3/08 of refractory metals
• CPC Class Codes: H01Q 1/12 Supports; Mounting means
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2203/0315 : Oxidising metal
• CPC Class Codes: H05K 3/4602 : characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Abstract

The disclosed embodiments include a method of integrating metal elements separated by gaps with a structure that conceals the metal elements and gaps. The method includes treating a metal substrate to a plasma electrolytic oxidation process to form a ceramic layer from a portion of the metal substrate, thereby providing the ceramic layer and an underlying metal portion of the metal substrate. The method further includes etching gap(s) in the underlying metal portion of the metal substrate to form metal elements separated by the gap(s), and backfilling the gap(s) with a non-conductive substance. As such, the metal elements, the non-conductive substance filling the gap(s), and the ceramic layer collectively form a structure whereby the ceramic layer at least partially conceals the metal elements and the gap(s).

Claims

1. A method of integrating metal elements separated by one or more gaps with a structure that conceals the metal elements and the one or more gaps, the method comprising:

treating a metal substrate to a plasma electrolytic oxidation process to form a ceramic layer from a portion of the metal substrate, thereby providing the ceramic layer and an underlying metal portion of the metal substrate;

etching one or more gaps in the underlying metal portion of the metal substrate to form a plurality of metal elements separated by the one or more gaps, wherein the etching comprises;

etching the metal substrate by using a computer numerical control mechanical machining process to create one or more cavities on the metal substrate that are sufficiently deep to define one or more areas for etching the one or more gaps completely through the metal substrate and sufficiently shallow to avoid damaging the ceramic layer with vibrations from the computer numerical control mechanical machining process, and

etching the metal substrate by using an electrochemical etching process to complete the one or more gaps through the metal substrate as defined by the cavities created by the computer numerical control mechanical machining process;

backfilling the one or more gaps with a non-conductive substance such that the plurality of metal elements, the non-conductive substance filling the one or more gaps, and the ceramic layer collectively form a structure whereby the ceramic layer at least partially conceals the plurality of metal elements and the one or more gaps with the non-conductive substance; and

coating all exposed surfaces of each of the plurality of metal elements with the non-conductive substance such that the plurality of metal elements are completely electrically isolated.

2. The method of claim 1, wherein, prior to etching the one or more gaps, the method further comprising:

applying a stabilizing layer over the ceramic layer such that the stabilizing layer provides increased mechanical stability for the ceramic layer during the etching of the one or more gaps.

3. The method of claim 2, wherein the stabilizing layer comprises an epoxy.

4. The method of claim 2, wherein the stabilizing layer comprises a removable plastic tape, the method further comprising:

removing the plastic tape after backfilling the one or more gaps.

5. The method of claim 1, wherein the metal substrate comprises any of titanium, aluminum, magnesium, or metal alloy.

6. The method of claim 1, wherein the ceramic layer comprises titanium oxide.

7. The method of claim 1, wherein the non-conductive substance is an adhesive that bonds the ceramic layer and plurality of metal elements.

8. A method of manufacturing a structure including concealed electrically conductive elements, the method comprising:

forming a ceramic layer on an underlying conductive portion of a conductive substrate;

etching the underlying conductive portion into a plurality of electrically insulated conductive regions such that the ceramic layer at least partially conceals the plurality of electrically insulated conductive regions, the etching comprising;

subjecting the underlying conductive portion to an initial computer numerical control mechanical machining process to commence forming one or more gaps that separate the plurality of electrically insulated conductive regions, and

subjecting the underlying conductive portion of the conductive substrate to an electrochemical etching process to complete the forming of the one or more gaps;

backfilling the one or more gaps with a non-conductive substance such that the non-conductive substance bonds the ceramic layer and the plurality of electrically insulated conductive regions; and

coating all exposed surfaces of each of the plurality of metal elements with the non-conductive substance such that the plurality of metal elements are completely electrically isolated.

9. The method of claim 8, wherein the ceramic layer is formed on an underlying conductive portion of a conductive substrate by treating a surface of the conductive substrate to a plasma electrolytic oxidation process.

10. The method of claim 8, wherein the ceramic layer at least partially conceals the one or more gaps.

11. The method of claim 8, wherein, prior to etching the underlying conductive portion, the method further comprises:

applying a stabilizing layer over the ceramic layer such that the stabilizing layer provides increased mechanical stability for the ceramic layer during the etching of the underlying conductive portion.

12. A method of integrating titanium elements separated by one or more gaps with a structure that conceals the titanium elements and the one or more gaps, the method comprising:

treating a titanium substrate to a plasma electrolytic oxidation process to form a titanium oxide layer and an underlying titanium layer;

etching one or more gaps in the underlying titanium layer to form a plurality of titanium elements separated by the one or more gaps, wherein the etching comprises;

mechanically etching an initial portion of each of the one or more gaps without damaging the titanium oxide layer, and

electrochemically etching a remaining portion of each of the one or more gaps though the plurality of titanium elements to the titanium oxide layer;

backfilling the one or more gaps with an insulating material, wherein the titanium oxide layer at least partially conceals the plurality of titanium elements and the one or more gaps backfilled with the insulating material; and

coating all exposed surfaces of each of the plurality of titanium elements with insulating material such that the plurality of titanium elements are completely electrically isolated.

13. The method of claim 12, wherein etching the one or more gaps comprises only electrochemically etching each of the one or more gaps.

14. The method of claim 12, wherein, prior to etching the one or more gaps, the method further comprising:

applying an epoxy layer over the titanium oxide layer such that the epoxy layer provides increased mechanical stability for the titanium oxide layer during the etching of the one or more gaps to form the plurality of titanium elements.