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Electronic assembly with thermal channel and method of manufacture thereof

  • US 9,898,056 B2
  • Filed: 06/19/2013
  • Issued: 02/20/2018
  • Est. Priority Date: 06/19/2013
  • Status: Active Grant
First Claim
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1. A method of manufacturing of an electronic assembly, the method comprising:

  • providing an airflow bracket having an end rail that includes a vent opening therein and at least one detachable airflow tab attached to and extending from the end rail;

    coupling a top circuit board to the end rail; and

    coupling a bottom circuit board to the end rail;

    wherein;

    the top circuit board, the bottom circuit board, and the at least one detachable airflow tab form a thermal channel between the top circuit board and the bottom circuit board for directing air through the vent opening of the end rail;

    the at least one detachable airflow tab, the top circuit board and the bottom circuit board form distinct walls of the thermal channel that are exposed to airflow through the thermal channel and direct the airflow through the thermal channel; and

    the at least one detachable airflow tab is configured to be coupled end-to-end to another detachable airflow tab via respective locking tabs for extending the thermal channel.

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