Method for fabricating package structure

• US 9,899,335 B2
• Filed: 10/20/2016
• Issued: 02/20/2018
• Est. Priority Date: 07/25/2014
• Status: Active Grant

• Current Assignee: Siliconware Precision Industries Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Siliconware Precision Industries Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Chiu, Chih-Hsien, Chung, Hsin-Lung, Chang, Cho-Hsin, Chen, Chia-Yang, Yang, Chao-Ya
• Primary Examiner(s): Maruf, Sheikh
• Application Number:
  US15/298,480
• Publication Number:
  US 20170103953A1
• Time in Patent Office: 488 Days
• Field of Search: 438110-113, 257664, 257690
• CPC Class Codes: H01L 21/485 Adaptation of interconnections, e.g. engineering charges, repair techniques
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48157 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/552 : Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 : High-frequency adaptations
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1421 : RF devices
• CPC Class Codes: H01L 2924/15159 : Side view
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.

Claims

1. A method for fabricating a package structure, comprising:

providing a package body that has a carrier, a plurality of electronic components disposed on the carrier, and an encapsulant formed on the carrier for encapsulating the electronic components, wherein the package body is defined with a plurality of package units, each of the package units having at least one of the electronic components;

forming a plurality of trenches among the package units;

forming a first shielding layer on the encapsulant and in the trenches;

performing a singulation process along the trenches to singulate out the package units, with the first shielding layer remaining on the package units; and

forming at least one second shielding layer on the first shielding layer,

wherein the first shielding layer and the at least one second shielding layer are made of different materials.

2. The method of claim 1, wherein the electronic component is a radio frequency chip.

3. The method of claim 1, wherein the first shielding layer is made of an insulative material or a conductive material.

4. The method of claim 1, wherein the at least one second shielding layer is made of a conductive material.

5. The method of claim 1, wherein the trenches penetrate the encapsulant.

6. The method of claim 5, wherein the trenches extend into the carrier.

7. The method of claim 1, wherein the first shielding layer is further formed along surfaces of the trenches.