Discrete device mounted on substrate

• US 9,899,339 B2
• Filed: 11/05/2012
• Issued: 02/20/2018
• Est. Priority Date: 11/05/2012
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Romig, Matthew David, Wright, Lance Cole, Stark, Leslie Edward, Stepniak, Frank, Koduri, Sreenivasan K.
• Primary Examiner(s): Oh, Jaehwan
• Application Number:
  US13/668,901
• Publication Number:
  US 20140124939A1
• Time in Patent Office: 1,933 Days
• Field of Search: None
• CPC Class Codes: H01L 2224/24011 Deposited, e.g. MCM-D type
• CPC Class Codes: H01L 2224/2405 Shape
• CPC Class Codes: H01L 2224/24265 the item being a discrete passive component
• CPC Class Codes: H01L 2224/245 Material
• CPC Class Codes: H01L 2224/27 Manufacturing methods
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/73217 Layer and HDI connectors
• CPC Class Codes: H01L 2224/8121 using a reflow oven
• CPC Class Codes: H01L 2224/81815 Reflow soldering
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/822 Applying energy for connecting
• CPC Class Codes: H01L 2224/8221 with energy being in the form of electromagnetic radiation
• CPC Class Codes: H01L 2224/82399 Material
• CPC Class Codes: H01L 2224/8284 Sintering
• CPC Class Codes: H01L 2224/8312 Aligning
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8321 using a reflow oven
• CPC Class Codes: H01L 2224/83862 Heat curing
• CPC Class Codes: H01L 2224/92 Specific sequence of method steps
• CPC Class Codes: H01L 2224/92144 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/5223 : Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5227 : Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/5228 : Resistive arrangements or effects of, or between, wiring layers other resistive arrangements H01L23/647
• CPC Class Codes: H01L 23/5328 : containing conductive organic materials or pastes, e.g. conductive adhesives, inks
• CPC Class Codes: H01L 23/64 : Impedance arrangements
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19104 : on the semiconductor or solid-state device, i.e. passive-on-chip

Abstract

A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.

Claims

1. An IC package comprising:

a discrete electrical device having a first surface, an opposing second surface, a plurality of third surfaces connecting said first and second surfaces, and a plurality of electrical terminals, at least one terminal of said plurality of electrical terminals substantially forming at least a portion of one of said third surfaces and extending substantially to said first surface of said discrete electrical device;

a substrate having a first surface in direct contact with said discrete electrical device and a contact pad corresponding to said first surface of the substrate; and

conductive ink electrically connecting said at least one terminal of said plurality of electrical terminals with said contact pad.

2. The IC package of claim 1, wherein said conductive ink has a three dimensional L-shaped configuration having a first leg touching said discrete electrical device and a second leg touching the substrate.

3. The IC package of claim 1 wherein said conductive ink comprises a nano-paste layer.

4. The IC package of claim 1 wherein said conductive ink comprises a conductive paste layer.

5. The IC package of claim 1 wherein said discrete electrical device comprises at least one of a sensor, MEMS, and oscillator.

6. The IC package of claim 1 wherein said first leg and said second leg have a cross sectional width of about 1 μ

m to 100 μ

m.

7. The IC package of claim 1 further comprising a protective layer of encapsulant over a portion of said discrete electrical device, a portion of said conductive ink, and a portion of said substrate.

8. The IC package of claim 1, said contact pad in direct contact with said discrete electrical device.

9. The IC package of claim 1, said at least one terminal located on said contact pad.