Method for interconnecting stacked semiconductor devices
First Claim
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1. A semiconductor assembly comprising:
- a first die assembly including;
a first die having a first die upper surface and a first die lower surface, anda first rim extending laterally from the first die, wherein the first rim includes a first upper rim face proximate the first die upper surface and a first lower rim face proximate the first die lower surface, the first die lower surface and the first lower rim face proximate input and output arrays for the semiconductor assembly;
a second die assembly over the first die assembly, the second die assembly including;
a second die, having a second die upper surface and a second die lower surface,a second rim extending laterally away from the second die, wherein the second rim includes a second upper rim face proximate the second die upper surface and a second lower rim face proximate the second die lower surface, anda plurality of conductive traces extending outwardly beyond the second die toward the second lower rim face;
wherein at least the first upper rim face is an upper most surface of the first die assembly and the second lower rim face is a bottom most surface of the second die assembly, and the plurality of conductive traces are interposed between the first upper rim face and the second lower rim face; and
one or more vias extending through at least one of the first and second rims, the one or more vias in communication with the first and second dice through the plurality of conductive traces and at least one of the first or second rims.
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Abstract
A method for making a semiconductor device includes forming rims on first and second dice. The rims extend laterally away from the first and second dice. The second die is stacked over the first die, and one or more vias are drilled through the rims after stacking. The semiconductor device includes redistribution layers extending over at least one of the respective first and second dice and the corresponding rims. The one or more vias extend through the corresponding rims, and the one or more vias are in communication with the first and second dice through the rims.
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Citations
23 Claims
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1. A semiconductor assembly comprising:
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a first die assembly including; a first die having a first die upper surface and a first die lower surface, and a first rim extending laterally from the first die, wherein the first rim includes a first upper rim face proximate the first die upper surface and a first lower rim face proximate the first die lower surface, the first die lower surface and the first lower rim face proximate input and output arrays for the semiconductor assembly; a second die assembly over the first die assembly, the second die assembly including; a second die, having a second die upper surface and a second die lower surface, a second rim extending laterally away from the second die, wherein the second rim includes a second upper rim face proximate the second die upper surface and a second lower rim face proximate the second die lower surface, and a plurality of conductive traces extending outwardly beyond the second die toward the second lower rim face; wherein at least the first upper rim face is an upper most surface of the first die assembly and the second lower rim face is a bottom most surface of the second die assembly, and the plurality of conductive traces are interposed between the first upper rim face and the second lower rim face; and one or more vias extending through at least one of the first and second rims, the one or more vias in communication with the first and second dice through the plurality of conductive traces and at least one of the first or second rims. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for making a semiconductor assembly comprising:
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forming a first die assembly including; forming a first rim on a first die, the first rim extending laterally from the first die, and the first rim includes an exposed upper rim face proximate a first die upper surface of the first die; forming a second die assembly including; forming a second rim on a second die, the second rim extending laterally from the second die, and the second rim includes an exposed lower rim face proximate a second die lower surface of the second die, and forming a plurality of conductive traces extending beyond the second die to the exposed lower rim face; layering the exposed lower rim face of the second die assembly over the exposed upper rim face of the first die assembly, the plurality of conductive traces interposed between the exposed upper rim face and the exposed lower rim face; and forming one or more vias extending through at least one of the first and second rims, the one or more vias in communication with the first and second dice. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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Specification