Printable device wafers with sacrificial layers gaps
First Claim
1. A wafer of devices comprising:
- a substrate;
a sacrificial layer on the substrate, the sacrificial layer comprising an array of gaps;
at least one tether laterally extending from a sidewall of each gap in the array of gaps; and
an array of devices, each of the devices laterally attached to at least one respective tether such that each device is suspended within a respective gap of the array of gaps, wherein the tethers are at least partially in a common layer with at least a portion of the devices.
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Accused Products
Abstract
Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer.
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Citations
19 Claims
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1. A wafer of devices comprising:
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a substrate; a sacrificial layer on the substrate, the sacrificial layer comprising an array of gaps; at least one tether laterally extending from a sidewall of each gap in the array of gaps; and an array of devices, each of the devices laterally attached to at least one respective tether such that each device is suspended within a respective gap of the array of gaps, wherein the tethers are at least partially in a common layer with at least a portion of the devices. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A wafer of integrated circuit devices comprising:
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a substrate; a sacrificial layer on the substrate, the sacrificial layer comprising an array of gaps defining anchors separating the gaps; at least one tether laterally extending from a sidewall of each anchor; and an array of integrated circuit devices, each of the integrated circuit devices laterally attached to at least one respective tether such that each integrated circuit is suspended entirely over a respective gap of the array of gaps, wherein the tethers are at least partially in a common layer with at least a portion of the integrated circuit devices. - View Dependent Claims (18, 19)
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Specification