×

Process for preparing a semiconductor structure for mounting

  • US 9,899,578 B2
  • Filed: 08/14/2015
  • Issued: 02/20/2018
  • Est. Priority Date: 09/28/2006
  • Status: Active Grant
First Claim
Patent Images

1. A device comprising:

  • a semiconductor structure comprising;

    a light emitting layer disposed between an n-type region and a p-type region;

    a plurality of voids extending into the n-type region, the light emitting layer, and the p-type region of the semiconductor structure;

    an n-electrode metal disposed in the plurality of voids, wherein the n-electrode metals extends to an edge of the device;

    a reflective metal disposed on the p-type region;

    a p-electrode metal disposed on the reflective metal; and

    a support material disposed in the plurality of voids, wherein a surface of the device is planar, wherein the planar surface of the device includes a surface of the support material, a surface of the n-electrode metal, and a surface of the p-electrode metal.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×