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Light emitting apparatus

  • US 9,899,581 B2
  • Filed: 07/01/2015
  • Issued: 02/20/2018
  • Est. Priority Date: 12/09/2009
  • Status: Active Grant
First Claim
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1. A light emitting device comprising:

  • a conductive support substrate;

    a bonding layer on the conductive support substrate;

    a light emitting structure layer on the bonding layer;

    a passivation layer provided on a side surface and a top surface of the light emitting structure layer;

    a first metal layer between the bonding layer and the passivation layer, wherein the first metal layer is directly in-contact with a bottom surface of the passivation layer; and

    an electrode structure disposed on the light emitting structure layer,wherein the electrode structure includes an outer electrode including a first part and a second part, an inner electrode provided in a region between the first part and the second part of the outer electrode and extending to electrically connect the first part of the outer electrode with the second part of the outer electrode, and a pad electrically connected to at least one of the first part and the second part of the outer electrode,wherein the outer electrode is spaced apart within a distance of 50 μ

    m from an outermost side of the light emitting structure layer,wherein the first metal layer includes at least one of Pt, Ti, W, Ni, Pd, Rh, Ir, or W,wherein the electrode structure comprises at least one roughness pattern on a top surface of the electrode structure,wherein the roughness pattern is directly in-contact with the passivation layer,wherein a top surface of the passivation layer is higher than a top most surface of the roughness pattern, andwherein a width of the pad is less than a distance between the outer electrode and the inner electrode.

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