High speed communication jack

• US 9,899,776 B2
• Filed: 04/11/2017
• Issued: 02/20/2018
• Est. Priority Date: 01/11/2013
• Status: Active Grant

• Current Assignee: Sentinel Connector Systems, Inc.
• Original Assignee: Sentinel Connector Systems, Inc.
• Inventors: Robinson, Brett D, Wagner, Justin
• Primary Examiner(s): GUSHI, ROSS N
• Application Number:
  US15/484,294
• Publication Number:
  US 20170229818A1
• Time in Patent Office: 315 Days
• CPC Class Codes: H01R 13/6466 on substrates, e.g. printed circuit boards [PCB]
• CPC Class Codes: H01R 13/6585 Shielding material individually surrounding or interposed between mutually spaced contacts
• CPC Class Codes: H01R 13/6599 Dielectric material made conductive, e.g. plastic material coated with metal
• CPC Class Codes: H01R 2107/00 Four or more poles
• CPC Class Codes: H01R 24/64 for high frequency, e.g. RJ 45
• CPC Class Codes: H01R 43/16 for manufacturing contact members, e.g. by punching and by bending
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/0245 Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
• CPC Class Codes: H05K 1/025 Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H01L23/66
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence

Abstract

A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via.

Claims

1. A high speed communication jack including:

a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug;

a shielding case surrounding the housing;

a circuit board in the housing having

a substrate,

a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing,

a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing,

a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via;

a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via; and

a first isolation region on the top surface between the first set of traces.

2. The jack of claim 1 wherein the second set of traces connect different vias that the vias connected on the top surface.

3. The jack of claim 1 including a second isolation region on the top surface between a second set of traces.

4. The jack of claim 1 including an isolation plane extending around the periphery of the substrate opposite the top layer.

5. The jack of claim 4 wherein the isolation plane is comprised of copper and finished silver.

6. The jack of claim 3 wherein isolation region is comprised of copper and finished silver.

7. The jack of claim 5 wherein the isolation plane is made of a material that is ¼

oz copper and ¼

oz silver.

8. The jack of claim 6 wherein the isolation plane is made of a material that is ¼

oz copper and ¼

oz silver.

9. The jack of claim 6 wherein the isolation plane includes a plurality of vias that connect the isolation plane connects to a grounding plane.

10. A method of manufacturing a high speed jack, the method including the steps of

forming a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug;

forming a shielding case surrounding the housing;

forming a top layer of a substrate,

forming a bottom layer opposite the top layer,

forming a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing,

forming a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing,

forming a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via;

forming a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via; and

forming a first isolation region on the top surface between the first set of traces.

11. The method of claim 10, wherein the second set of traces connect different vias that the vias connected on the top surface.

12. The method of claim 10 including the step of forming a second isolation region on the top surface between a second set of traces.

13. The method of claim 10 including forming an isolation plane extending around the periphery of the substrate opposite the top layer.

14. The method of claim 13 wherein the isolation plane is comprised of copper and finished silver.

15. The method of claim 13 wherein isolation region is comprised of copper and finished silver.

16. The method of claim 14 wherein the isolation plane is made of a material that is ¼

oz copper and ¼

oz silver.

17. The method of claim 15 wherein the isolation plane is made of a material that is ¼

oz copper and ¼

oz silver.

18. The method of claim 15 wherein the isolation plane includes a plurality of vias that connect the isolation plane connects to a grounding plane.