System for continuous monitoring of body sounds
First Claim
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1. A wearable monitoring system, comprising:
- a single microelectromechanical (MEMS) microphone configured to receive acoustic signal data through skin of a user;
an integrated circuit chip bonded to and electrically connected to the MEMS microphone;
a portable power source connected to at least the integrated circuit chip;
a flexible substrate configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user, and forming one or more first sound chambers between the flexible substrate and the skin of the user; and
a second sound chamber forming a gap between a diaphragm and the skin of the user.
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Abstract
A wearable monitoring system includes a microelectromechanical (MEMS) microphone to receive acoustic signal data through skin of a user. An integrated circuit chip is bonded to and electrically connected to the MEMS microphone. A portable power source is connected to at least the integrated circuit chip. A flexible substrate is configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user.
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Citations
20 Claims
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1. A wearable monitoring system, comprising:
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a single microelectromechanical (MEMS) microphone configured to receive acoustic signal data through skin of a user; an integrated circuit chip bonded to and electrically connected to the MEMS microphone; a portable power source connected to at least the integrated circuit chip; a flexible substrate configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user, and forming one or more first sound chambers between the flexible substrate and the skin of the user; and a second sound chamber forming a gap between a diaphragm and the skin of the user. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A wearable monitoring system, comprising:
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a single microelectromechanical (MEMS) microphone configured to receive acoustic signal data through skin of a user; an integrated circuit chip bonded to and electrically connected to the MEMS microphone using flip chip technology; a flexible substrate configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user using an adhesive, and forming one or more first sound chambers between the flexible substrate and the skin of the user; a portable power source connected to at least the integrated circuit chip including a battery-free tag formed on or in the flexible substrate for harvesting energy from radiofrequency signals; and a second sound chamber forming a gap between a diaphragm and the skin of the user. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method for monitoring body sounds, comprising:
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adhering a monitoring system to skin of a user using a flexible substrate to encapsulate and affix a single microelectromechanical (MEMS) microphone configured to receive acoustic signal data and an integrated circuit chip, which is bonded to and electrically connected to the MEMS microphone, the flexible substrate forming one or more first sound chambers between the flexible substrate and the skin of the user; forming a second sound chamber, the second sound chamber being formed by a gap between a diaphragm and the skin of the user; powering the monitoring system using a portable power source disposed in or on the flexible substrate; monitoring the acoustic signal data of the user through the skin of the user; and storing the acoustic signal data on the integrated circuit chip. - View Dependent Claims (18, 19, 20)
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Specification