Method of cooling series-connected heat sink modules

• US 9,901,013 B2
• Filed: 02/02/2015
• Issued: 02/20/2018
• Est. Priority Date: 06/27/2011
• Status: Active Grant

• Current Assignee: Ebullient, Inc.
• Original Assignee: Ebullient, Inc.
• Inventors: Shedd, Timothy A., Lindeman, Brett A.
• Primary Examiner(s): Jules, Frantz
• Assistant Examiner(s): Trpisovsky, Joseph
• Application Number:
  US14/612,276
• Publication Number:
  US 20150138723A1
• Time in Patent Office: 1,114 Days
• Field of Search: 62119, 62198, 622592, 62526
• CPC Class Codes: F25B 23/006 boiling cooling systems
• CPC Class Codes: F25B 2400/0401 for the compressor
• CPC Class Codes: F25B 2400/0403 for the condenser
• CPC Class Codes: F25B 2400/0409 for the evaporator
• CPC Class Codes: F25B 25/00 Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
• CPC Class Codes: F25B 41/00 Fluid-circulation arrangements
• CPC Class Codes: F25B 41/20 Disposition of valves, e.g. of on-off valves or flow control valves expansion valves F25B41/31
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: F28F 9/26 Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators connecting different sections in water heaters F24H9/14 , connecting headers with inlet or outlet fittings F28F9/0246
• CPC Class Codes: H05K 7/20327 Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/20809 within server blades for removing heat from heat source

Abstract

A method of cooling two or more heat-providing surfaces using a cooling apparatus having two or more fluidly connected heat sink modules in a series configuration can include providing a flow of single-phase liquid coolant to a first heat sink module mounted on a first heat-providing surface. The method can include projecting the flow of single-phase liquid coolant against the first heat-providing surface within the first heat sink module and causing phase change of a first portion of the liquid coolant and thereby forming two-phase bubbly flow with a first quality. The method can include transporting the two-phase bubbly flow to a second heat sink module and projecting the two-phase bubbly flow against a second heat-providing surface within the second heat sink module and causing phase change of a second portion of the coolant and formation of two-phase bubbly flow with a second quality greater than the first quality.

Claims

1. A method of cooling two heat-providing surfaces within a server using a cooling apparatus comprising two series-connected heat sink modules, the method comprising:

providing a flow of single-phase liquid coolant to an inlet port of a first heat sink module mounted on a first heat-providing surface within a server, wherein a first amount of heat is transferred from the first heat-providing surface to the single-phase liquid coolant resulting in vaporization of a portion of the single-phase liquid coolant thereby changing the flow of single-phase liquid coolant to two-phase bubbly flow comprising liquid coolant with vapor coolant dispersed as bubbles in the liquid coolant, the two-phase bubbly flow having a first quality; and

transporting the two-phase bubbly flow from an outlet port of the first heat sink module to an inlet port of a second heat sink module, wherein the second heat sink module is mounted on a second heat-providing surface within the server, wherein a second amount of heat is transferred from the second heat-providing surface to the two-phase bubbly flow resulting in vaporization of a portion of the liquid coolant within the two-phase bubbly flow thereby resulting in a change from the first quality to a second quality, the second quality being higher than the first quality,

wherein energy from the first amount of heat and the second amount of heat are stored, at least in part, as latent heat in the two-phase bubbly flow and transported out of the server through the cooling apparatus,

wherein the first quality is 0-0.1, 0.05-0.15, 0.1-0.2, 0.15-0.25, 0.2-0.3, 0.25-0.35, 0.3-0.4, 0.35-0.45, 0.4-0.5, 0.45-0.55, and the second quality is 0-0.1, 0.05-0.15, 0.1-0.2, 0.15-0.25, 0.2-0.3, 0.25-0.35, 0.3-0.4, or 0.4-0.45 greater than the first quality.

2. The method of claim 1, wherein a saturation temperature and pressure of the two-phase flow having a second quality is less than a saturation temperature and pressure of the two-phase flow having a first quality, thereby allowing the second heat-providing surface to be maintained at a lower temperature than the first heat-providing surface when a first heat flux from the first heat-providing surface is approximately equal to a second heat flux from the second heat-providing surface.

3. The method of claim 1, wherein providing the flow of single-phase liquid coolant to the inlet port of the first heat sink module comprises providing a flow rate of about 0.1-10, 0.2-5, 0.3-2.5, 0.6-1.2, or 0.8-1.1 liters per minute of single-phase liquid coolant to the first inlet of the first heat sink module.

4. The method of claim 1, wherein the flow of single-phase liquid coolant comprises a dielectric coolant.

5. The method of claim 4, wherein the dielectric coolant is HFE-7000, R-245fa, or a combination thereof.

6. The method of claim 1, wherein providing the flow of single-phase liquid coolant to the first heat sink module comprises providing the flow of single-phase liquid coolant at a predetermined temperature and a predetermined pressure, wherein the predetermined temperature is slightly below the saturation temperature of the flow of single-phase liquid coolant at the predetermined pressure.

7. The method of claim 6, wherein the predetermined temperature is about 0.5-20, 0.5-15, 0.5-10, 0.5-7, 0.5-5, 0.5-3, 0.5-1, 1-20, 1-15, 1-10, 1-7, 1-5, 1-3, 3-20, 3-15, 3- 10, 3-7, 3-5, 5-20, 5-15, 5-10, 5-7, 7-20, 7-15, 7-10, 10-20, 10-15, or 15-20 degrees C. below the saturation temperature of the flow of single-phase liquid coolant at the predetermined pressure.

8. The method of claim 1, further comprising providing a pressure differential of about 0.5-5.0, 0.5-3, or 1-3 psi between the inlet port of the first heat sink module and the outlet port of the first heat sink module, wherein the pressure differential is suitable to promote the flow to advance from the inlet port of the first heat sink module to the outlet port of the first heat sink module.

9. The method of claim 1, wherein the liquid coolant in the two-phase bubbly flow that is transported between the first heat sink module and the second heat sink module has a temperature at or slightly below its saturation temperature, the pressure of the two-phase bubbly flow being about 0.5-5.0, 0.5-3, or 1-3 psi less than a predetermined pressure of the flow of single-phase liquid coolant provided to the inlet port of the first heat sink module.

10. The method of claim 1, wherein the first heat-providing surface comprises a surface of a thermally conductive base member in thermal communication with a microprocessor within the server.

12. The method of claim 1, wherein a saturation temperature and pressure of the two-phase flow having a second number density is less than a saturation temperature and pressure of the two-phase flow having a first number density, thereby allowing the second heat-providing surface to be maintained at a lower temperature than the first heat-providing surface when a first heat flux from the first heat-providing surface is approximately equal to a second heat flux from the second heat-providing surface.

11. A method of cooling two or more heat-providing surfaces using a cooling apparatus comprising two or more fluidly connected heat sink modules arranged in a series configuration, the method comprising:

providing a flow of single-phase liquid coolant to a first inlet port of a first heat sink module mounted on a first heat-providing surface, the single-phase liquid coolant having a predetermined pressure and a predetermined temperature at the first inlet port of the first heat sink module, the predetermined temperature being slightly below a saturation temperature of the single-phase liquid coolant at the predetermined pressure;

projecting the flow of single-phase liquid coolant against the first heat-providing surface within the first heat sink module, wherein a first amount of heat is transferred from the first heat-providing surface to the flow of single-phase liquid coolant thereby inducing phase change in a portion of the flow of single-phase liquid coolant and thereby changing the flow of single-phase liquid coolant to two-phase bubbly flow comprising a liquid coolant and a plurality of vapor bubbles dispersed within the liquid coolant, the plurality of vapor bubbles having a first number density;

providing a second heat sink module mounted on a second heat-providing surface, the second heat sink module comprising a second inlet port and a second outlet port; and

providing a first section of tubing having a first end connected to the first outlet port of the first heat sink module and a second end connected to the second inlet port of the second heat sink module, wherein the first section of tubing transports the two-phase bubbly flow having the first number density from the first outlet port of the first heat sink module to the second inlet port of the second heat sink module; and

projecting the two-phase bubbly flow having the first number density against the second heat-providing surface within the second heat sink module, wherein a second amount of heat is transferred from the second heat-providing surface to the two-phase bubbly flow having a first number density and thereby changing two-phase bubbly flow having a first number density to a two-phase bubbly flow having a second number density greater than the first number density,

wherein the predetermined temperature of the flow of single-phase liquid coolant at the first inlet port of the first heat sink module is about 0.5-20, 0.5-15, 0.5-10, 0.5-7, 0.5-5, 0.5-3, 0.5-1, 1-20, 1-15, 1-10, 1-7, 1-5, 1-3, 3-20, 3-15, 3-10, 3-7, 3-5, 5-20, 5-15, 5-10, 5-7, 7-20, 7-15, 7-10, 10-20, 10-15, or 15-20 degrees C. below the saturation temperature of the flow of single-phase liquid coolant at the predetermined pressure of the flow of single-phase liquid coolant at the first inlet of the first heat sink module.

13. The method of claim 11, wherein providing the flow of single-phase liquid coolant to the inlet port of the first heat sink module comprises providing a flow rate of about 0.1-10, 0.2-5, 0.3-2.5, 0.6-1.2, or 0.8-1.1 liters per minute of single-phase liquid coolant to the first inlet port of the first heat sink module.

14. The method of claim 11, wherein the liquid in the two-phase bubbly flow being transported between the first heat sink module and the second heat sink module has a temperature at or slightly below its saturation temperature.

15. The method of claim 11, wherein the first heat sink module comprises:

an inlet chamber formed within the first heat sink module;

an outlet chamber formed within the first heat sink module, the outlet chamber having an open portion, the open portion configured to be enclosed by the first heat-providing surface when the first heat sink module is mounted on the first heat-providing surface; and

a plurality of orifices extending from the inlet chamber to the outlet chamber, wherein projecting the flow of single-phase liquid coolant against the first heat-providing surface within the first heat sink module comprises projecting a plurality of jet streams of single-phase liquid coolant into the outlet chamber and against the first heat-providing surface when the flow of single-phase liquid coolant is provided to the inlet chamber from the first inlet port of the first heat sink module.

16. The method of claim 15, wherein the first plurality of orifices have an average diameter of about 0.001-0.020, 0.001-0.2, 0.001-0.150, 0.001-0.120, 0.001-0.005, or 0.030-0.050 inches and are arranged at a jet height from the first heat-providing surface, the jet height being about 0.01-0.75, 0.05-0.5, 0.05-0.25, 0.020-0.25, 0.03-0.125, or 0.04-0.08 inches.

17. The method of claim 15, wherein at least one orifice of the plurality of orifices comprises a central axis, the central axis being arranged at an angle of about 30-60, 40-50, or 45 degrees with respect to the first heat-providing surface.

18. The method of claim 11, wherein a pressure of the two-phase bubbly flow having a first number density is about 0.5-5.0, 0.5-3, or 1-3 psi less than the predetermined pressure of the flow of single-phase liquid coolant provided to the first heat sink module.

19. A method of cooling two heat-providing surfaces within a server using a cooling apparatus comprising two series-connected heat sink modules, the method comprising:

providing a flow of single-phase liquid coolant to an inlet port of a first heat sink module mounted on a first heat-providing surface within a server, wherein a first amount of heat is transferred from the first heat-providing surface to the single-phase liquid coolant resulting in vaporization of a portion of the single-phase liquid coolant thereby changing the flow of single-phase liquid coolant to two-phase bubbly flow comprising liquid coolant with vapor coolant dispersed as bubbles in the liquid coolant, the two-phase bubbly flow having a first quality; and

transporting the two-phase bubbly flow from an outlet port of the first heat sink module to an inlet port of a second heat sink module, wherein the second heat sink module is mounted on a second heat-providing surface within the server, wherein a second amount of heat is transferred from the second heat-providing surface to the two-phase bubbly flow resulting in vaporization of a portion of the liquid coolant within the two-phase bubbly flow thereby resulting in a change from the first quality to a second quality, the second quality being higher than the first quality,

wherein energy from the first amount of heat and the second amount of heat are stored, at least in part, as latent heat in the two-phase bubbly flow and transported out of the server through the cooling apparatus,

wherein a saturation temperature and pressure of the two-phase flow having a second quality is less than a saturation temperature and pressure of the two phase flow having a first quality, thereby allowing the second heat-providing surface to be maintained at a lower temperature than the first heat-providing surface when a first heat flux from the first heat-providing surface is approximately equal to a second heat flux from the second heat-providing surface.

20. The method of claim 19, further comprising providing a pressure differential of about 0.5-5.0, 0.5-3, or 1-3 psi between the inlet port of the first heat sink module and the outlet port of the first heat sink module, wherein the pressure differential is suitable to promote the flow to advance from the inlet port of the first heat sink module to the outlet port of the first heat sink module.