Nanosensors and related technologies
First Claim
1. An article, comprising:
- a nanoscale wire comprising a first portion comprising a semiconductor material and a metal-semiconductor compound contained within the first portion in a spatial distribution defined by diffusion of atoms from a metal into the semiconductor material, and a second portion having a composition different from the first portion.
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Accused Products
Abstract
The present invention generally relates to nanotechnology and sub-microelectronic circuitry, as well as associated methods and devices, for example, nanoscale wire devices and methods for use in determining nucleic acids or other analytes suspected to be present in a sample. For example, a nanoscale wire device can be used in some cases to detect single base mismatches within a nucleic acid. In one aspect, dynamical information such as a binding constant, an association rate, and/or a dissociation rate, can be determined between a nucleic acid or other analyte, and a binding partner immobilized relative to a nanoscale wire. In some cases, the nanoscale wire includes a first portion comprising a metal-semiconductor compound, and a second portion that does not include a metal-semiconductor compound. The binding partner, in some embodiments, is immobilized relative to at least the second portion of the nanoscale wire.
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Citations
14 Claims
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1. An article, comprising:
a nanoscale wire comprising a first portion comprising a semiconductor material and a metal-semiconductor compound contained within the first portion in a spatial distribution defined by diffusion of atoms from a metal into the semiconductor material, and a second portion having a composition different from the first portion. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An article, comprising:
a nanoscale wire comprising a first portion and a second portion, the first portion comprising a semiconductor material and a metal-semiconductor compound contained within the first portion in a spatial distribution defined by diffusion of atoms from a metal into the semiconductor material, the first portion having a binding partner immobilized thereto, the second portion being free of the binding partner. - View Dependent Claims (9, 10, 11, 12, 13, 14)
Specification