Sensor package structure

• US 9,905,597 B2
• Filed: 07/12/2017
• Issued: 02/27/2018
• Est. Priority Date: 07/12/2016
• Status: Active Grant

• Current Assignee: Tong Hsing Electronic Industries, Ltd.
• Original Assignee: Kingpak Technology Inc.
• Inventors: Yang, Jo-Wei, Hsin, Chung-Hsien, Chen, Ming-Hui
• Primary Examiner(s): BOOTH, RICHARD A
• Application Number:
  US15/647,465
• Publication Number:
  US 20180019274A1
• Time in Patent Office: 230 Days
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers

Abstract

A sensor package structure includes a substrate, a sensing member, a shielding member, a metallic wire, and an encapsulating compound. The substrate includes a die bonding zone and a wiring zone. The sensing member is mounted on the die bonding zone and includes a sensing zone, a carrying zone arranged around the sensing zone, and a connecting zone arranged outside of the carrying zone. The shielding member includes a translucent covering portion and a supporting portion connected to a peripheral portion of the covering portion. The supporting portion having a coefficient of thermal expansion less than 10 ppm/° C. is fixed on the carrying zone. The metallic wire connects the wiring zone and the connecting zone. The encapsulating compound is disposed on the wiring zone and covers a peripheral side of the sensing member, the connecting zone, and a peripheral side of the shielding member.

Claims

1. A sensor package structure, comprising:

a substrate having an upper surface and a lower surface opposite to the upper surface, wherein the upper surface of the substrate includes a die bonding zone and a wiring zone arranged outside of the die bonding zone;

a sensing member mounted on the die bonding zone of the substrate, wherein a top surface of the sensing member arranged distant from the substrate includes a sensing zone, a carrying zone having a ring shape and arranged around the sensing zone, and a connecting zone arranged outside of the carrying zone;

a shielding member including a translucent covering portion and a ring-shaped supporting portion connected to a peripheral portion of the covering portion, wherein the supporting portion having a coefficient of thermal expansion less than 10 ppm/°

C. is fixed on the carrying zone of the sensing member, the shielding member and the top surface of the sensing member surroundingly co-define an enclosed accommodating space, and the sensing zone is arranged in the accommodating space;

at least one metallic wire having two opposite ends, wherein the two ends of the at least one metallic wire are respectively connected to the wiring zone of the substrate and the connecting zone of the sensing member to establish an electrical connection between the substrate and the sensing member; and

an encapsulating compound disposed on the wiring zone and covering a peripheral side of the sensing member, the connecting zone, and a peripheral side of the shielding member, wherein the at least one metallic wire is embedded in the encapsulating compound.

2. The sensor package structure as claimed in claim 1, wherein the supporting portion is translucent, the supporting portion and the covering portion have the same coefficient of thermal expansion, and the supporting portion is adhered to or integrally formed on the covering portion.

3. The sensor package structure as claimed in claim 1, wherein a peripheral side of the covering portion does not protrude out of that of the supporting portion.

4. The sensor package structure as claimed in claim 1, wherein the encapsulating compound includes a liquid compound, a top surface of the liquid compound is in an arc shape, and the top surface of the liquid compound and an upper surface of the covering portion are formed with a cut angle within a range of 0˜

60 degrees.

5. The sensor package structure as claimed in claim 4, further comprising a blocking member, wherein the blocking member is disposed on the upper surface of the covering portion and is arranged inside of the peripheral side of the covering portion by a predetermined distance, a portion of the upper surface of the covering portion arranged between the peripheral side of the covering portion and the blocking member is defined as an attaching zone, and the encapsulating compound further includes a molding compound formed on the top surface of the liquid compound and the attaching zone.

6. The sensor package structure as claimed in claim 5, wherein the attaching zone is arranged in a projecting region defined by orthogonally projecting the supporting portion onto the upper surface of the covering portion, and a width of the supporting portion is within a range of 0.5˜

2 mm.

7. The sensor package structure as claimed in claim 1, wherein the coefficient of thermal expansion of the supporting portion is within a range of 2.6˜

7.2 ppm/°

C.

8. The sensor package structure as claimed in claim 1, wherein a height of the supporting portion is more than or equal to 300 μ

m.

9. The sensor package structure as claimed in claim 8, wherein a height of the shielding member is 40˜

80% of a height of the sensor package structure.

10. A sensor package structure, comprising:

a substrate having an upper surface and a lower surface opposite to the upper surface, wherein the upper surface of the substrate includes a die bonding zone and a wiring zone arranged outside of the die bonding zone;

a sensing member having a width more than or equal to 10 mm and mounted on the die bonding zone of the substrate, wherein a top surface of the sensing member arranged distant from the substrate includes a sensing zone, a carrying zone having a ring shape and arranged around the sensing zone, and a connecting zone arranged outside of the carrying zone;

a shielding member including a translucent covering portion and a ring-shaped supporting portion connected to a peripheral portion of the covering portion, wherein the supporting portion having a height more than or equal to 300 μ

m is fixed on the carrying zone of the sensing member, the shielding member and the top surface of the sensing member surroundingly co-define an enclosed accommodating space, and the sensing zone is arranged in the accommodating space;

at least one metallic wire having two opposite ends, wherein the two ends of the at least one metallic wire are respectively connected to the wiring zone of the substrate and the connecting zone of the sensing member to establish an electrical connection between the substrate and the sensing member; and

an encapsulating compound disposed on the wiring zone and covering a peripheral side of the sensing member, the connecting zone, and a peripheral side of the shielding member, wherein the at least one metallic wire is embedded in the encapsulating compound.

11. The sensor package structure as claimed in claim 10, wherein the supporting portion is translucent, the supporting portion and the covering portion have the same coefficient of thermal expansion, and the supporting portion is adhered to or integrally formed on the covering portion.

12. The sensor package structure as claimed in claim 10, wherein a peripheral side of the covering portion does not protrude out of that of the supporting portion.

13. The sensor package structure as claimed in claim 10, wherein a height of the shielding member is 40˜

80% of a height of the sensor package structure.