Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus
First Claim
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1. A semiconductor device, comprising:
- a first semiconductor chip including a plurality of photoelectric conversion elements and a first multi wiring layer;
a second semiconductor chip including a second multi wiring layer,wherein the first semiconductor chip and the second semiconductor chip are bonded to each other with the first multi wiring layer facing the second multi wiring layer;
a connection conductor, wherein a wiring of the first multi layer wiring and a wiring of the second multi layer wiring electrically connect the first multi wiring layer to the second multi wiring layer through a first conductive portion and a second conductive portion, and wherein the second conductive portion comprises Cu and Al.
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Abstract
A semiconductor device including a first material layer adjacent to a second material layer, a first via passing through the first material layer and extending into the second material layer, and a second via extending into the first material layer, where along a common cross section parallel to an interface between the two material layers, the first via has a cross section larger than that of the second via.
20 Citations
19 Claims
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1. A semiconductor device, comprising:
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a first semiconductor chip including a plurality of photoelectric conversion elements and a first multi wiring layer; a second semiconductor chip including a second multi wiring layer, wherein the first semiconductor chip and the second semiconductor chip are bonded to each other with the first multi wiring layer facing the second multi wiring layer; a connection conductor, wherein a wiring of the first multi layer wiring and a wiring of the second multi layer wiring electrically connect the first multi wiring layer to the second multi wiring layer through a first conductive portion and a second conductive portion, and wherein the second conductive portion comprises Cu and Al. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor device, comprising:
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a first semiconductor chip including a plurality of photoelectric conversion elements and a first multi wiring layer; a second semiconductor chip including a second multi wiring layer, wherein the first semiconductor chip and the second semiconductor chip are bonded to each other with the first multi wiring layer facing the second multi wiring layer; a connection conductor, wherein the wiring of the first multi layer wiring and the wiring of the second multi layer wiring electrically connect the first multi wiring layer to the second multi wiring layer through a first conductive portion and a second conductive portion, a bonding wire, wherein the bonding wire connects an electrode pad portion to an external wiring, and wherein the second conductive portion and the electrode pad portion comprise the same material. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification