Thin film transistor, method of manufacturing the same, and display apparatus
First Claim
1. A thin film transistor, comprising:
- a gate electrode;
a first insulating film as a gate insulating film;
an oxide semiconductor film as a channel layer, said oxide semiconductor film comprising at least one of a Sn—
In—
Zn oxide, an In—
Zn—
Ga oxide, an In—
Sn oxide, an In—
Ga oxide, an In—
Zn oxide or an In oxide;
a second insulating film as a protective layer for protecting the channel layer; and
a source electrode and a drain electrode, whereina part of each of the source electrode and the drain electrode covers the oxide semiconductor film, and another part of each of the source electrode and the drain electrode covers the second insulating film, andeach of the first insulating film and the second insulating film includes a silicon oxide layer, and a film thickness of that part of the second insulating film which is covered with either of the source electrode and the drain electrode is not more than half of a film thickness of the first insulating film.
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Accused Products
Abstract
Provided is a bottom gate type thin film transistor including on a substrate (1) a gate electrode (2), a first insulating film (3) as a gate insulating film, an oxide semiconductor layer (4) as a channel layer, a second insulating film (5) as a protective layer, a source electrode (6), and a drain electrode (7), in which the oxide semiconductor layer (4) includes an oxide including at least one selected from the group consisting of In, Zn, and Sn, and the second insulating film (5) includes an amorphous oxide insulator formed so as to be in contact with the oxide semiconductor layer (4) and contains therein 3.8×1019 molecules/cm3 or more of a desorbed gas observed as oxygen by temperature programmed desorption mass spectrometry.
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Citations
31 Claims
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1. A thin film transistor, comprising:
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a gate electrode; a first insulating film as a gate insulating film; an oxide semiconductor film as a channel layer, said oxide semiconductor film comprising at least one of a Sn—
In—
Zn oxide, an In—
Zn—
Ga oxide, an In—
Sn oxide, an In—
Ga oxide, an In—
Zn oxide or an In oxide;a second insulating film as a protective layer for protecting the channel layer; and a source electrode and a drain electrode, wherein a part of each of the source electrode and the drain electrode covers the oxide semiconductor film, and another part of each of the source electrode and the drain electrode covers the second insulating film, and each of the first insulating film and the second insulating film includes a silicon oxide layer, and a film thickness of that part of the second insulating film which is covered with either of the source electrode and the drain electrode is not more than half of a film thickness of the first insulating film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A thin film transistor, comprising:
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a gate electrode; a first insulating film as a gate insulating film; an oxide semiconductor film as a channel layer, said oxide semiconductor film comprising at least one of a Sn—
In—
Zn oxide, an In—
Zn—
Ga oxide, an In—
Sn oxide, an In—
Ga oxide, an In—
Zn oxide or an In oxide;a second insulating film as a protective layer for protecting the channel layer; and a source electrode and a drain electrode, wherein a part of each of the source electrode and the drain electrode covers the oxide semiconductor film, and another part of each of the source electrode and the drain electrode covers the second insulating film, and a film thickness of that part of the second insulating film which is covered with either of the source electrode and the drain electrode is not more than half of a film thickness of the first insulating film. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A thin film transistor, comprising:
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a gate electrode; a first insulating film; an oxide semiconductor film; a second insulating film; and a source electrode and a drain electrode, wherein the first insulating film is provided between the oxide semiconductor film and the gate electrode, the oxide semiconductor film is provided between the first insulating film and the second insulating film, a part of each of the source electrode and the drain electrode covers the oxide semiconductor film, and another part of each of the source electrode and the drain electrode covers the second insulating film, each of the first insulating film and the second insulating film includes a silicon oxide, and a film thickness of that part of the second insulating film which is covered with either of the source electrode and the drain electrode is not more than half of a film thickness of the first insulating film. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification