Method for manufacturing semiconductor device
First Claim
1. A semiconductor device comprising:
- an oxide semiconductor layer;
a source electrode over the oxide semiconductor layer;
a drain electrode over the oxide semiconductor layer;
an oxide layer over the source electrode and the drain electrode, wherein the oxide layer is in contact with a portion of the oxide semiconductor layer, the portion being between the source electrode and the drain electrode;
a gate insulating layer over the oxide layer; and
a gate electrode over the gate insulating layer,wherein the oxide semiconductor layer includes a first n-type region below the source electrode and a second n-type region below the drain electrode,wherein an upper surface of the oxide semiconductor layer between the source electrode and the drain electrode is etched, andwherein the oxide layer is in contact with the first n-type region and the second n-type region.
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Accused Products
Abstract
To improve electric characteristics of a semiconductor device including an oxide semiconductor. Alternatively, to improve reliability of a semiconductor device including an oxide semiconductor. In a transistor including a first oxide film, an oxide semiconductor film, a pair of electrodes in contact with the oxide semiconductor film, and a second oxide film in contact with the oxide semiconductor film and the pair of electrodes, oxygen is added to the first oxide film and the second oxide film in contact with the oxide semiconductor film and the pair of electrodes, so that oxygen vacancies are reduced. The oxygen is diffused to the oxide semiconductor film by heat treatment or the like; thus, oxygen vacancies in the oxide semiconductor film are reduced.
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Citations
16 Claims
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1. A semiconductor device comprising:
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an oxide semiconductor layer; a source electrode over the oxide semiconductor layer; a drain electrode over the oxide semiconductor layer; an oxide layer over the source electrode and the drain electrode, wherein the oxide layer is in contact with a portion of the oxide semiconductor layer, the portion being between the source electrode and the drain electrode; a gate insulating layer over the oxide layer; and a gate electrode over the gate insulating layer, wherein the oxide semiconductor layer includes a first n-type region below the source electrode and a second n-type region below the drain electrode, wherein an upper surface of the oxide semiconductor layer between the source electrode and the drain electrode is etched, and wherein the oxide layer is in contact with the first n-type region and the second n-type region. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device comprising:
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an oxide semiconductor layer; a source electrode over the oxide semiconductor layer; a drain electrode over the oxide semiconductor layer; an oxide layer over the source electrode and the drain electrode, wherein the oxide layer is in contact with a portion of the oxide semiconductor layer, the portion being between the source electrode and the drain electrode; a gate insulating layer over the oxide layer; and a gate electrode over the gate insulating layer, wherein the oxide semiconductor layer includes a first n-type region below the source electrode and a second n-type region below the drain electrode, wherein an upper surface of the oxide semiconductor layer between the source electrode and the drain electrode is etched, wherein the oxide layer is in contact with the first n-type region and the second n-type region, wherein each of the source electrode and the drain electrode comprises a first conductive layer and a second conductive layer, wherein the second conductive layer is provided on the first conductive layer, and wherein the second conductive layer extends beyond an inner side edge of the first conductive layer. - View Dependent Claims (8, 9, 10)
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11. A semiconductor device comprising:
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an oxide semiconductor layer; a source electrode over the oxide semiconductor layer; a drain electrode over the oxide semiconductor layer; an oxide layer over the source electrode and the drain electrode, wherein the oxide layer is in contact with a portion of the oxide semiconductor layer, the portion being between the source electrode and the drain electrode; a gate insulating layer over the oxide layer; and a gate electrode over the gate insulating layer, wherein the oxide semiconductor layer includes a first n-type region below the source electrode and a second n-type region below the drain electrode, wherein an upper surface of the oxide semiconductor layer between the source electrode and the drain electrode is etched, wherein the oxide layer is in contact with the first n-type region and the second n-type region, and wherein each of the source electrode and the drain electrode comprises a metal nitride layer in contact with the oxide semiconductor layer. - View Dependent Claims (12, 13, 14, 15, 16)
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Specification