Printed LED heat sink double lock

• US 9,905,743 B2
• Filed: 07/23/2015
• Issued: 02/27/2018
• Est. Priority Date: 11/21/2013
• Status: Expired due to Fees

• Current Assignee: Ford Global Technologies, LLC (Ford Motor Company)
• Original Assignee: Ford Global Technologies, LLC (Ford Motor Company)
• Inventors: Salter, Stuart C., Dellock, Paul Kenneth, Surman, James J.
• Primary Examiner(s): Carter, William
• Application Number:
  US14/807,132
• Publication Number:
  US 20150333240A1
• Time in Patent Office: 950 Days
• Field of Search: 362543-545
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/42 Transparent materials
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05B 45/00 Circuit arrangements for operating light-emitting diodes [LED]
• CPC Class Codes: H05B 47/11 by determining the brightness or colour temperature of ambient light
• CPC Class Codes: H05B 47/115 by determining the presence or movement of objects or living beings
• CPC Class Codes: Y02B 20/40 Control techniques providing energy savings, e.g. smart controller or presence detection

Abstract

A light emitting assembly is disclosed. The assembly comprises a heat sink of an electrically conductive material configured to function as a first electrode. A plurality of LEDs in a semiconductor ink is disposed on the first electrode and operable to emit an excitation emission. The assembly further comprises a second electrode in communication with the plurality of LEDs and at least one photoluminescent layer proximate at least one of the electrodes. The photoluminescent layer is configured to convert the excitation emission to an output emission.

Claims

1. A light emitting assembly comprising:

a heat sink of an electrically conductive material and configured to function as a first electrode;

at least one protective layer formed to the assembly;

a plurality of LEDs in a semiconductor ink disposed on the first electrode and operable to emit an excitation emission;

a second electrode in communication with the plurality of LEDs; and

at least one photoluminescent layer proximate at least one of the electrodes configured to convert the excitation emission to an output emission, wherein the heat sink and the protective layer are stamped together forming a locking interconnection.

2. The light emitting assembly according to claim 1, wherein the at lease one protective layer comprises a first protective layer disposed on an outward directed surface of the second electrode.

3. The light emitting assembly according to claim 2, wherein the first protective layer is thermal formed to the second electrode.

4. The light emitting assembly according to claim 2, wherein the at least one protective layer further comprises a second protective layer disposed substantially around the heat sink and the first protective layer configured to seal the light emitting assembly.

5. The light emitting assembly according to claim 1, wherein the heat sink has a thickness ranging of approximately 0.02 mm to 0.5 mm.

6. The light emitting assembly according to claim 1, wherein the electrically conductive material of the heat sink corresponds to aluminum alloy forming a base portion on which the plurality of LEDs are printed.

7. The light emitting assembly according to claim 1, wherein the locking interconnection corresponds to a locking profile comprising a plurality of angled portions of the first protective layer and the heat sink.

8. The light emitting assembly according to claim 7, wherein the plurality of angled portions correspond to a plurality of segments of the first protective layer and the heat sink.

9. The light emitting assembly according to claim 8, wherein the plurality of segments form a plurality of perpendicular intersections configured to retain the first protective layer with the heat sink.

10. The light emitting assembly according to claim 9, wherein the locking interconnection corresponds to a riveted connection configured to bind the locking interconnection.

11. A light emitting assembly comprising:

a heat sink of an electrically conductive material forming a first electrode;

a plurality of LEDs in a semiconductor ink disposed on the first electrode;

a second electrode in communication with the plurality of LEDs; and

a protection layer disposed on at lease one of the first electrode and the second electrode, wherein the heat sink and the at least one protective layer are stamped together forming a locking interconnection.

12. The assembly according to claim 11, further comprising a first bus bar extending along at least a portion of a perimeter of the light emitting assembly and in conductive connection with the first electrode.

13. The assembly according to claim 12, further comprising a second bus bar extending along at least a portion of the perimeter of the light emitting assembly and in conductive connection with the second electrode.

14. The assembly according to claim 13, wherein electrical current is supplied to the plurality of LEDs via the first bus bar such that the current flows substantially uniformly from the first bus bar to the second bus bar.

15. A method of manufacturing a lighting apparatus for a vehicle comprising the steps of:

printing a light producing layer in a semi-conductor ink on a first electrode configured to disperse heat energy;

printing a top transparent conductor layer on the light producing layer to form a second electrode;

thermal-forming the first protective layer to create a first seal configured to protect the light producing layer to form a first sealed assembly, the first sealed assembly comprising the first electrode, the light producing layer, and the second electrode; and

stamping the first sealed assembly to form a locking interconnection in a stamped portion between the first electrode and the first seal.

16. The method according to claim 15, wherein stamping the first sealed assembly forms a plurality of intersecting angled portions between the first electrode and the first seal.

17. The method according to claim 15, wherein the stamped portion is located centrally in the lighting apparatus.

18. The method according to claim 15, further comprising conductively connecting a first bus bar to the first electrode extending proximate a perimeter of the lighting apparatus.

19. The method according to claim 18, further comprising conductively connecting a second bus bar to the second electrode extending proximate the perimeter of the lighting apparatus.