Printed circuit board having electronic component embedded
First Claim
1. A printed circuit board having an electronic component embedded, comprising:
- a first electrically conductive layer;
a first core layer having a portion removed to expose at least a portion of the electronic component and a portion of a second core layer, wherein the exposed portion of the electronic component has a top surface higher than or equal to a top surface of the exposed portion of the second core layer;
the second electrically conductive layer;
the second core layer having an area which is hollow so as to accommodate the electronic component therein;
a third electrically conductive layer;
a third core layer; and
a fourth electrically conductive layer,wherein a bound pad is formed on a portion of a top surface of the electronic component and is electrically connected to the first electrically conductive layer by a via hole formed in the first core layer, and each of the electrically conductive layers forms a desired circuit.
1 Assignment
0 Petitions
Accused Products
Abstract
A printed circuit board having an electronic component embedded is disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.
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Citations
11 Claims
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1. A printed circuit board having an electronic component embedded, comprising:
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a first electrically conductive layer; a first core layer having a portion removed to expose at least a portion of the electronic component and a portion of a second core layer, wherein the exposed portion of the electronic component has a top surface higher than or equal to a top surface of the exposed portion of the second core layer; the second electrically conductive layer; the second core layer having an area which is hollow so as to accommodate the electronic component therein; a third electrically conductive layer; a third core layer; and a fourth electrically conductive layer, wherein a bound pad is formed on a portion of a top surface of the electronic component and is electrically connected to the first electrically conductive layer by a via hole formed in the first core layer, and each of the electrically conductive layers forms a desired circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification