High-power electronic module and method for making such a module

• US 9,907,199 B2
• Filed: 09/04/2015
• Issued: 02/27/2018
• Est. Priority Date: 09/08/2014
• Status: Active Grant

• Current Assignee: Schneider Electric Industries SAS (Schneider Electric SE)
• Original Assignee: Schneider Electric Industries SAS (Schneider Electric SE)
• Inventors: Wu, Cong Martin
• Primary Examiner(s): LEE, JINHEE J
• Assistant Examiner(s): Chowdhury, Rockshana
• Application Number:
  US14/845,736
• Publication Number:
  US 20160073535A1
• Time in Patent Office: 907 Days
• Field of Search: 361728
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49844 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 24/10 Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 25/071 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H05K 3/341 Surface mounted components
• CPC Class Codes: H05K 7/026 Multiple connections subassemblies
• CPC Class Codes: H05K 7/06 on insulating boards , e.g. wiring harnesses for printed circuits H05K1/18, H05K3/30
• CPC Class Codes: H05K 7/1023 co-operating by abutting, e.g. flat pack

Abstract

A power electronic module including at least one pair of power electronic components, each pair including a first and a second component, each component including a first face, configured to be supported on a support and a second face configured to be electrically connected to an electrical circuit with a smaller thermal contact area than the contact area between the first face and the support, and a first and a second support. The first component in each pair is supported by the first support and is connected to a second electrical circuit of the second support and the second component in each pair is supported on the second support and is connected to a first electrical circuit of the first support.

Claims

1. A power electronic module comprising:

a plurality of pairs of power electronic components each pair comprising at least a first power electronic component and a second power electronic component which are identical, a first support and a second support arranged approximately parallel to each other, the first support comprising a first electrical circuit and the second support comprising a second electrical circuit,

the first power electronic component of each pair comprising a first face and a second face, the first power electronic component of each pair being supported by the first face on the first support in electrical contact with the first electrical circuit and being electrically connected to the second electrical circuit by the second face with a smaller thermal contact area than a contact area between the first face and the first support;

the second power electronic component of each pair comprising a third face and a fourth face, the second power electronic component of each pair being supported by the third face on the second support in electrical contact the second electrical circuit and being electrically connected to the first electrical circuit by the fourth face with a smaller thermal contact area than a contact area between the third face and the second support, the first power electronic component and the second power electronic component of each pair having a redundant arrangement,

wherein the first power electronic component of at least one pair of the plurality of pair which comprises at least a first control contact and at least a first power contact and a second power contact, the first control contact being located on the second face of the first power electronic component of the at least one pair and at least the first power contact being located on the first face of the first power electronic component of the at least one pair,

wherein the second power electronic component of the at least one pair comprises at least a second control contact and at least a third power contact and a fourth power contact, the second control contact being located on the fourth face of the second power electronic component of the at least one pair and at least the third power contact being located on the third face of the second power electronic component of the at least one pair,

wherein the first electrical circuit includes at least one first high power circuit conducting track, and a first control conducting track, the second electrical circuit including at least one third high power circuit conducting track, and a second control conducting track,

wherein the first power electronic component of the at least one pair is arranged on the first support with the first power contact of the first face in contact with the first high power circuit conducing track and with the first control contact connected to the third control conducting track, and second power electronic component of the at least one pair is arranged on the second support with the second power contact of the fourth face in contact with the first high power circuit conducting track and with the third control contact connected to the first control conducting track.

2. The power electronic module according to claim 1, wherein the first power electronic component of each pair have the second face connected to the second electrical circuit by means of solder bridges, the second power electronic component of each pair having the fourth face connected to the first electric circuit by means of other solder bridges.

3. The power electronic module according to claim 1, wherein the first face of the first power electronic component of each pair is to the first support by solder or brazing material, the third face of the second power electronic component of each pair being fixed to the second support by solder or brazing material.

4. The power electronic module according to claim 1, wherein the first control conducting track of the first support has a track portion facing the second power conducting track of the second support and in which the third control conducting track of the second support has a track portion facing the first high power circuit conducting track of the first support.

5. The power electronic module according to claim 4, wherein the first power electronic components of the at least one pair, has the second power contact arranged on the second face, the second power electronic components of the at least one pair having the fourth power contact arranged on the fourth face,

wherein the first electrical circuit comprises at least one second high power circuit conducting track, the second electrical circuit comprising at least one fourth high power circuit conducing track,

wherein the first power electronic component of the at least one pair, has the second control contact connected to the fourth high power circuit conducting track, the second power electronic component of the at least one pair having the fourth control contact connected to the second high power circuit conducting track.

6. The power electronic module according to claim 5, wherein the second high power circuit conducting track comprises a track portion facing the second control conducting track, the fourth high power circuit conducting track comprising a track portion facing the first control conducing track.