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Image sensor with tolerance optimizing interconnects

  • US 9,907,459 B2
  • Filed: 10/05/2015
  • Issued: 03/06/2018
  • Est. Priority Date: 05/12/2011
  • Status: Active Grant
First Claim
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1. An imaging sensor comprising:

  • a plurality of substrates comprising a first substrate and at least one second, subsequent supporting substrate;

    a pixel array;

    a plurality of interconnects; and

    a plurality of supporting circuits;

    wherein the first substrate of the plurality of substrates comprises a plurality of pixel read buses and the pixel array, wherein the pixel array comprises a plurality of pixel groups, and wherein there is one pixel read bus per pixel group;

    wherein the at least one second, subsequent supporting substrate comprises a plurality of circuit buses and the plurality of supporting circuits, including a plurality of readout supporting circuits, with one circuit bus per readout supporting circuit;

    wherein said plurality of supporting circuits are electrically connected to, and in electrical communication with, said pixel array via the plurality of interconnects disposed between said first substrate and said at least one second, subsequent supporting substrate;

    wherein each of the plurality of interconnects reads out a pixel group to one of the circuit buses;

    wherein said at least one second, subsequent supporting substrate is disposed behind said first substrate relative to an object to be imaged;

    wherein said plurality of interconnects are spaced relative to one another at a distance that is greater than a pixel pitch of said pixel array.

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