Image sensor with tolerance optimizing interconnects
First Claim
1. An imaging sensor comprising:
- a plurality of substrates comprising a first substrate and at least one second, subsequent supporting substrate;
a pixel array;
a plurality of interconnects; and
a plurality of supporting circuits;
wherein the first substrate of the plurality of substrates comprises a plurality of pixel read buses and the pixel array, wherein the pixel array comprises a plurality of pixel groups, and wherein there is one pixel read bus per pixel group;
wherein the at least one second, subsequent supporting substrate comprises a plurality of circuit buses and the plurality of supporting circuits, including a plurality of readout supporting circuits, with one circuit bus per readout supporting circuit;
wherein said plurality of supporting circuits are electrically connected to, and in electrical communication with, said pixel array via the plurality of interconnects disposed between said first substrate and said at least one second, subsequent supporting substrate;
wherein each of the plurality of interconnects reads out a pixel group to one of the circuit buses;
wherein said at least one second, subsequent supporting substrate is disposed behind said first substrate relative to an object to be imaged;
wherein said plurality of interconnects are spaced relative to one another at a distance that is greater than a pixel pitch of said pixel array.
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Abstract
Embodiments of a hybrid imaging sensor that optimizes a pixel array area on a substrate using a stacking scheme for placement of related circuitry with minimal vertical interconnects between stacked substrates and associated features are disclosed. Embodiments of maximized pixel array size/die size (area optimization) are disclosed, and an optimized imaging sensor providing improved image quality, improved functionality, and improved form factors for specific applications common to the industry of digital imaging are also disclosed. Embodiments of the above may include systems, methods and processes for staggering ADC or column circuit bumps in a column or sub-column hybrid image sensor using vertical interconnects are also disclosed.
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Citations
20 Claims
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1. An imaging sensor comprising:
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a plurality of substrates comprising a first substrate and at least one second, subsequent supporting substrate; a pixel array; a plurality of interconnects; and a plurality of supporting circuits; wherein the first substrate of the plurality of substrates comprises a plurality of pixel read buses and the pixel array, wherein the pixel array comprises a plurality of pixel groups, and wherein there is one pixel read bus per pixel group; wherein the at least one second, subsequent supporting substrate comprises a plurality of circuit buses and the plurality of supporting circuits, including a plurality of readout supporting circuits, with one circuit bus per readout supporting circuit; wherein said plurality of supporting circuits are electrically connected to, and in electrical communication with, said pixel array via the plurality of interconnects disposed between said first substrate and said at least one second, subsequent supporting substrate; wherein each of the plurality of interconnects reads out a pixel group to one of the circuit buses; wherein said at least one second, subsequent supporting substrate is disposed behind said first substrate relative to an object to be imaged; wherein said plurality of interconnects are spaced relative to one another at a distance that is greater than a pixel pitch of said pixel array. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification