PZT amorphous alloy plating solution and method for plating a PZT amorphous alloy using the same

• US 9,909,225 B2
• Filed: 05/29/2016
• Issued: 03/06/2018
• Est. Priority Date: 03/11/2016
• Status: Active Grant

• Current Assignee: CammSys Corp.
• Original Assignee: BEFS Co., Ltd.
• Inventors: Lee, Seungjin, Bang, Changhyeok, Yun, Daeyeong
• Primary Examiner(s): Wong, Edna
• Application Number:
  US15/168,061
• Publication Number:
  US 20170260640A1
• Time in Patent Office: 646 Days
• Field of Search: 205238, 205244, 205252, 106 125, 106 129
• CPC Class Codes: C23C 18/1633 Process of electroless plating
• CPC Class Codes: C23C 18/48 Coating with alloys
• CPC Class Codes: C25D 21/14 Controlled addition of electrolyte components
• CPC Class Codes: C25D 3/56 of alloys
• CPC Class Codes: C25D 9/08 by cathodic processes
• CPC Class Codes: C25D 9/10 on iron or steel
• CPC Class Codes: C25D 9/12 on light metals

Abstract

The present invention relates to the lead-zirconate-titanate (PZT) amorphous alloy plating solution which may be used to form a PZT amorphous alloy film having excellent mechanical and physical properties and a method for plating a PZT amorphous alloy using the same. The PZT amorphous alloy plating solution may include a Pb precursor, a Zr precursor, and a Ti precursor. 10˜50 parts by weight of the Zr precursor and 5˜30 parts by weight of the Ti precursor may be included based on 100 parts by weight of the Pb precursor. Accordingly, electrical conductivity can be improved because the PZT amorphous alloy plating solution has a structure which has low crystallinity or which is amorphous. Furthermore, excellent electrical characteristics can be achieved because the PZT amorphous alloy plating solution has excellent conductivity or chemical stability.

Claims

1. A lead-zirconate-titanate (PZT) amorphous alloy plating solution, comprising:

a Pb precursor, a Zr precursor, a Ti precursor, and at least one of a reducing agent, a complexing agent, a stabilizer, an organic acid, and an amide-series compound,

wherein 10˜

50 parts by weight of the Zr precursor and 5˜

30 parts by weight of the Ti precursor are included based on 100 parts by weight of the Pb precursor, and

wherein the reducing agent comprises a phenolic-series compound represented by the chemical formula below;

2. A method for plating a lead-zirconate-titanate (PZT) amorphous alloy, comprising:

preparing a PZT amorphous alloy plating solution comprising a Pb precursor, a Zr precursor, and a Ti precursor; and

dipping an electrode into the prepared PZT amorphous alloy plating solution and performing plating using an electric current,

wherein preparing the PZT amorphous alloy plating solution comprises;

fabricating a metal powder aqueous solution having a sulfuric acid with the Pb precursor, the Zr precursor, and the Ti precursor; and

including at least one of a group consisting of a reducing agent, a complexing agent, a stabilizer, an organic acid, and an amide-series compound in the metal powder aqueous solution and mixing at least one of the group and the metal powder aqueous solution.

3. The method of claim 2, further comprising:

discoloring when a concentration of lead, zirconium, and titanium included in the PZT amorphous alloy plating solution becomes a specific concentration or less after performing the plating; and

supplementing the PZT amorphous alloy plating solution with the Pb precursor, the Zr precursor, and the Ti precursor.

4. The method of claim 2, wherein fabricating the metal powder aqueous solution further comprises including the sulfuric acid in 10˜

50 parts by weight of the Zr precursor and 5˜

30 parts by weight of the Ti precursor based on 100 parts by weight of the Pb precursor.

5. The method of claim 2, wherein the reducing agent comprises a phenolic-series compound represented by the chemical formula below:

6. The method of claim 2, wherein performing the plating comprises performing the plating using an electric current density of 3˜

20.0 A/dm² at a temperature of 10˜

30°

C.