Sound damping wallboard and method of forming a sound damping wallboard

• US 9,909,304 B2
• Filed: 10/13/2016
• Issued: 03/06/2018
• Est. Priority Date: 02/05/2015
• Status: Active Grant

• Current Assignee: Gold Bond Building Products LLC
• Original Assignee: National Gypsum Properties LLC
• Inventors: Blades, Michael N., Watt, John M., Yakowenko, John E., Broud, Todd D., O'Leary, Keith R., Cusa, Stephen A., Quiros, Mauricio, Randall, Brian G., Weir, Richard P.
• Primary Examiner(s): Phillips, Forrest M
• Application Number:
  US15/293,184
• Publication Number:
  US 20170037617A1
• Time in Patent Office: 509 Days
• Field of Search: 181290
• CPC Class Codes: B32B 2307/102 Insulating
• CPC Class Codes: B32B 2315/18 Plaster
• CPC Class Codes: B32B 2607/00 Walls, panels
• CPC Class Codes: B32B 37/12 characterised by using adhesives
• CPC Class Codes: B32B 37/14 characterised by the properties of the layers
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B32B 9/06 of paper or cardboard
• CPC Class Codes: E04B 1/8409 sheet-shaped
• CPC Class Codes: E04B 1/86 slab-shaped
• CPC Class Codes: E04B 2001/8461 layered
• CPC Class Codes: F16B 11/006 by gluing gluing of plastics material B29C65/48
• CPC Class Codes: G10K 11/168 Plural layers of different materials, e.g. sandwiches

Abstract

A sound damping wallboard and methods of forming a sound damping wallboard are disclosed. The sound damping wallboard includes a gypsum layer having a first side with a first gypsum surface, a first encasing layer at least partially covering the first gypsum surface to form a first encasing layer portion, and a sound damping layer on the first side covering at least part of the first encasing layer portion.

Claims

1. A sound damping wallboard, comprising:

a gypsum layer having a first side with a first gypsum surface;

a first encasing layer at least partially covering the first gypsum surface to form a first encasing layer portion;

a sound damping layer on the first side covering at least part of the first encasing layer portion, the sound damping layer having a sound damping layer surface opposite the gypsum layer; and

an outer encasing layer on the sound damping layer surface.

2. The sound damping wallboard of claim 1, wherein the first encasing layer completely covers the first gypsum surface to form the first encasing layer portion.

3. The sound damping wallboard of claim 1, wherein the first encasing layer has a weight of between about 30 and about 60 pounds per thousand square feet of surface area.

4. The sound damping wallboard of claim 1, wherein the gypsum layer has a thickness of between about 0.25 inches and about 0.375 inches.

5. The sound damping wallboard of claim 1, wherein the gypsum layer has a density of at least 1200 pounds per thousand square feet.

6. The sound damping wallboard of claim 1, wherein the sound damping layer comprises a viscoelastic polymer.

7. A method of forming a sound damping wallboard, comprising the steps of:

providing a first gypsum layer having a first side with a first gypsum surface, and a first encasing layer covering the first gypsum surface; and

removing at least part of the first encasing layer to expose the first gypsum surface, form a first gypsum surface portion on the first side, and allow application of a sound damping layer to the first side to cover at least part of the first gypsum surface portion.

8. The method of claim 7, wherein removing at least part of the first encasing layer includes removing by abrasion.

9. The method of claim 8, wherein removing by abrasion includes removing by a moving surface.

10. The method of claim 9, further comprising transporting the first gypsum layer and the first encasing layer to the moving surface.

11. The method of claim 10, wherein the moving surface includes an abrasive material.

12. The method of claim 7, wherein removing at least part of the first encasing layer includes removing by planing.

13. The method of claim 12, wherein removing by planing includes removing by at least one blade.

14. The method of claim 13, further comprising transporting the first gypsum layer and the first encasing layer to the at least one blade.

15. The method of claim 7, wherein removing at least part of the first encasing layer includes removing by peeling.

16. The method of claim 15, wherein removing by peeling includes removing with a pulling member.

17. The method of claim 16, further comprising transporting the first gypsum layer and the first encasing layer to the pulling member.

18. A sound damping wallboard, comprising:

a gypsum layer having a first side with a first gypsum surface and a second side with a second gypsum surface;

a first encasing layer at least partially covering the first gypsum surface;

a second encasing layer at least partially covering the second gypsum surface opposite the first gypsum surface;

a sound damping layer at the first side of the gypsum layer and at least partially covering the first encasing layer portion, the sound damping layer having a sound damping layer surface opposite the gypsum layer; and

an outer encasing layer on the sound damping layer surface.

19. The sound damping wallboard of claim 18, wherein the first encasing layer completely cover the first gypsum surface and the second encasing layer completely covers the second gypsum surface.

20. The sound damping wallboard of claim 18, wherein each of the first encasing layer and the second encasing layer has a weight of between about 30 and about 60 pounds per thousand square feet of surface area.

21. The sound damping wallboard of claim 18, wherein the gypsum layer has a thickness of between about 0.25 inches and about 0.375 inches.

22. The sound damping wallboard of claim 18, wherein the gypsum layer has a density of at least 1200 pounds per thousand square feet.