Methods and apparatus for sensor diagnostics including programmable self-test signals

• US 9,910,088 B2
• Filed: 12/22/2014
• Issued: 03/06/2018
• Est. Priority Date: 12/26/2013
• Status: Active Grant

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: Milano, Shaun D., El Bacha, Georges, Doogue, Michael C., Taylor, William P.
• Primary Examiner(s): Vazquez, Arleen M
• Assistant Examiner(s): Shah, Neel
• Application Number:
  US14/578,813
• Publication Number:
  US 20150185279A1
• Time in Patent Office: 1,170 Days
• Field of Search: 32420721, 32420725, 324500, 324537, 324555, 324610
• CPC Class Codes: G01R 31/2829 Testing of circuits in sensor or actuator systems testing of apparatus for measuring electric or magnetic variables G01R35/00; testing of indicating or recording apparatus G01D; in airbag systems B60R21/0173; checking gas analysers G01N33/007; monitoring or fail-safe circuits for electromagnets H01F7/1844
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/3187 Built-in tests
• CPC Class Codes: G01R 33/00 Arrangements or instruments for measuring magnetic variables
• CPC Class Codes: G01R 33/0023 Electronic aspects, e.g. circuits for stimulation, evaluation, control; Treating the measured signals; calibration G01R33/0017 takes precedence
• CPC Class Codes: G01R 33/02 Measuring direction or magnitude of magnetic fields or magnetic flux G01R33/20 takes precedence
• CPC Class Codes: G01R 33/07 Hall effect devices
• CPC Class Codes: G01R 33/09 Magnetoresistive devices
• CPC Class Codes: G01R 33/091 Constructional adaptation of the sensor to specific applications
• CPC Class Codes: G01R 35/00 Testing or calibrating of apparatus covered by the other groups of this subclass
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

Methods and apparatus to provide an integrated circuit having a magnetic sensing element and fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition. In illustrative embodiments, a fault pin indicates the fault condition.

Claims

1. An integrated circuit, comprising:

a magnetic sensing element;

fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition; and

a fault pin to indicate the fault condition, wherein the fault pin comprises an input/output pin such that pulling the fault pin to a given voltage level for a given time provides a self-test request to initiate the self-test operation, and

wherein the fault detection module includes at least one switch to cycle through connections to known voltage and ground signals and verify expected fault and no fault signals on the fault pin for the self-test operation of the circuitry for detecting the fault condition.

2. The integrated circuit according to claim 1, wherein the fault detection module includes a window comparator having at least one threshold associated with the fault condition.

3. The integrated circuit according to claim 2, wherein the at least one threshold corresponds to a short circuit.

4. The integrated circuit according to claim 3, wherein the short circuit is located in a signal path extending from the window comparator to the magnetic sensing element.

5. The integrated circuit according to claim 2, wherein the fault pin is activated to a given state upon fault detection by the at least one threshold.

6. The integrated circuit according to claim 1, wherein self-test signals of the self-test operation are programmable in duration.

7. A method, comprising:

coupling a magnetic sensing element to fault detection module in an integrated circuit;

providing the fault detection module to include circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition;

providing self-test signals; and

providing a fault pin to indicate the fault condition,

wherein the fault pin comprises an input/output pin such that pulling the fault pin to a given voltage level for a given time provides a self-test request to initiate the self-test operation, and

wherein the fault detection module includes at least one switch to cycle through connections to known voltage and ground signals and verify expected fault and no fault signals on the fault pin for the self-test operation of the circuitry for detecting the fault condition.

8. The method according to claim 7, wherein the fault detection module includes a window comparator having at least one threshold associated with the fault condition.

9. The method according to claim 8, wherein the at least one threshold corresponds to a short circuit condition.

10. The method according to claim 9, wherein the short circuit condition is located in a signal path extending from the window comparator to the magnetic sensing element.

11. The method according to claim 8, wherein the fault pin is activated to a given state upon fault detection by the at least one threshold.

12. The method according to claim 8, wherein the fault condition includes a current level above a threshold.

13. The method according to claim 8, wherein the given time of the self-test request is programmable.

14. The method according to claim 8, wherein the given time of the self-test request corresponds to power up initiation of self-test request.

15. The method according to claim 8, wherein the self-test operation is entered only when an applied magnetic field is below a magnetic field threshold.

16. The method according to claim 8, further including controlling a voltage on the fault pin to provide an acknowledge signal indicating entrance into the self-test operation.

17. The method according to claim 16, wherein an amount of time the acknowledge signal is active is programmable.

18. The method according to claim 16, further including controlling the voltage level on the fault pin to provide results from the self-test operation.

19. The method according to claim 18, further including timing the voltage level on the fault pin to indicate a pass or a fail of the self-test operation.

20. The method according to claim 19, wherein a transition of the voltage level at a first time indicates pass, a transition of the voltage level at a second indicates a sensor test fail, and a transition of the voltage level at a third time indicates a fault failure.

21. The method according to claim 20, wherein the first, second, and third times are programmable.

22. The method according to claim 7, further including initiating the self-test operation after a temperature change of greater than a temperature threshold.

23. The method according to claim 7, wherein the integrated circuit comprises a package having exactly four pins.

24. The method according to claim 7, further including employing a die supported by a leadframe having a region cutout from the leadframe, wherein the location of the magnetic sensing element is aligned with the region to reduce Eddy currents.

25. The method according to claim 7, wherein the self-test is terminated when a magnetic field above a flux threshold is detected.

26. The method according to claim 7, wherein the integrated circuit comprises a linear current sensor.

27. The method according to claim 7, wherein self-test signals of the self-test operation are programmable in duration.

28. An integrated circuit, comprising:

a magnetic sensing element;

fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition, wherein the fault detection module includes a window comparator having at least one threshold associated with the fault condition; and

a fault pin to indicate the fault condition,

wherein the fault pin comprises an input/output pin such that pulling the fault pin to a given voltage level for a given time provides a self-test request to initiate the self-test operation, and wherein the fault detection module includes at least one switch to cycle through connections to known voltage and ground signals and verify expected fault and no fault signals on the fault pin for the self-test operation of the circuitry for detecting the fault condition.