Electronic component

• US 9,911,529 B2
• Filed: 06/04/2014
• Issued: 03/06/2018
• Est. Priority Date: 01/06/2012
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Sasaki, Soitsu
• Primary Examiner(s): Enad, Elvin G
• Assistant Examiner(s): HOSSAIN, KAZI S
• Application Number:
  US14/296,239
• Publication Number:
  US 20140285306A1
• Time in Patent Office: 1,371 Days
• Field of Search: 336200, 336 83, 336192, 336232
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00

Abstract

In an electronic component, a multilayer body is formed by a plurality of stacked insulator layers. A coil includes at least one coil conductor layer provided on at least one of the insulator layers. External electrodes are embedded in a lateral surface of the multilayer body which is formed by a series of continuous perimeter edges of the plurality of insulator layers, and includes a plurality of stacked external conductor layers provided on the plurality of insulator layers. The external electrodes have different shapes. The external conductor layers and the first coil conductor, which are provided on the same insulator layer, are simultaneously formed by photolithography or printing.

Claims

1. An electronic component comprising:

a multilayer body having a shape of a rectangular parallelepiped, and including a plurality of stacked insulator layers;

a first coil including two or more first coil conductor layers respectively provided on two or more consecutive insulator layers of the plurality of stacked insulator layers; and

first and second external electrodes embedded in a lateral surface of the multilayer body which is formed by a series of continuous perimeter edges of the plurality of stacked insulator layers, each of the first and second external electrodes including a plurality of stacked external conductor layers embedded in the lateral surface of the multilayer body, the plurality of stacked external conductor layers of each of the first and second external electrodes being provided on the plurality of stacked insulator layers, the first and second external electrodes being electrically connected to the first coil,

wherein one of the stacked external conductor layers of each of the first and second external electrodes is provided on each of the two or more consecutive insulator layers, and

the stacked external conductor layers on each of the two or more consecutive insulator layers have different shapes from each other.

2. The electronic component according to claim 1, further comprising a second coil including at least one second coil conductor layer provided on at least one of the plurality of stacked insulator layers, wherein the stacked external conductor layers and the second coil conductor are photolithographed or printed on the same insulator layer.

3. The electronic component according to claim 1, wherein a thickness of the first external electrode is different from a thickness of the second external electrode.

4. The electronic component according to claim 1, wherein a shape of a portion of the first external electrode which is exposed from the multilayer body is different from a shape of a portion of the second external electrode which is exposed from the multilayer body.

5. The electronic component according to claim 1, wherein

the first external electrode extends over three lateral surfaces, and

the second external electrode extends over two lateral surfaces.

6. The electronic component according to claim 5, wherein

the first external electrode extends over the three lateral surfaces in plan view in a stacking direction of the plurality of stacked insulator layers, and

the second external electrode extends over only the two lateral surfaces in plan view in the stacking direction, the first coil having a helical shape around an axis parallel to the stacking direction.