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Process for making and using mesh-style NCEM pads

  • US 9,911,649 B1
  • Filed: 09/08/2016
  • Issued: 03/06/2018
  • Est. Priority Date: 02/03/2015
  • Status: Expired due to Fees
First Claim
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1. A method for processing a semiconductor substrate, comprising at least the following steps:

  • using one or more mask(s) to pattern a plurality of adjacent source/drain contact (AACNT) stripes on the substrate;

    using one or more mask(s) to pattern a plurality of adjacent gate contact (GATECNT) stripes on the substrate;

    wherein the GATECNT stripes perpendicularly intersect the AACNT stripes to form a mesh-style non-contact electrical measurement (NCEM) pad; and

    after forming the NCEM pad, obtaining in-line NCEM from the mesh-style NCEM pad.

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