Display apparatus and method of manufacturing the same

• US 9,911,764 B2
• Filed: 07/13/2016
• Issued: 03/06/2018
• Est. Priority Date: 08/31/2015
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Bae, Jongsung, Kim, Mugyeom
• Primary Examiner(s): Page, Dale E
• Assistant Examiner(s): JEFFERSON, QUOVAUNDA
• Application Number:
  US15/208,750
• Publication Number:
  US 20170062492A1
• Time in Patent Office: 601 Days
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/1259 Multistep manufacturing methods
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of manufacturing a display apparatus includes separating a light-emitting diode (“LED”) chip from a base substrate; disposing the separated light-emitting diode chip in a solution; disposing a substrate including a first electrode thereon, in the solution; with the separated light-emitting diode chip and the substrate including the first electrode thereon in the solution, applying a negative voltage to the substrate to attract the separated light-emitting diode chip to the first electrode on the substrate; mounting the light-emitting diode chip attracted to the first electrode, on the first electrode; and removing the substrate with the light-emitting diode chip mounted on the first electrode from the solution and drying the removed substrate, to form the display apparatus.

Claims

1. A method of manufacturing a display apparatus, the method comprising:

separating a light-emitting diode chip from a base substrate;

disposing the separated light-emitting diode chip in a solution;

disposing a substrate including a first electrode and a second electrode which is spaced apart from the first electrode to be insulated from the first electrode thereon, in the solution;

with the separated light-emitting diode chip and the substrate including the first and second electrode thereon in the solution, applying a negative voltage to the substrate to attract the separated light-emitting diode chip to the first and second electrodes on the substrate,

wherein the applying the negative voltage to the substrate comprises applying a first negative voltage to the first electrode and applying a second negative voltage to the second electrode;

mounting the light-emitting diode chip attracted to the first and second electrode, on the first and second electrodes; and

removing the substrate with the light-emitting diode chip mounted on the first and second electrodes from the solution and drying the removed substrate, to form the display apparatus.

2. The method of claim 1, wherein the separated light-emitting diode chip is a flip chip comprising a first contact pad and a second contact pad exposed facing a same direction.

3. The method of claim 2, wherein the applying the negative voltage to the substrate attracts the first contact pad of the separated light-emitting diode chip to the first electrode of the substrate, and attracts the second contact pad of the separated light-emitting diode chip to the second electrode of the substrate.

4. The method of claim 1, wherein the first and second negative voltages are direct current voltages.

5. The method of claim 1, further comprising encapsulating the light-emitting diode chip mounted on the first and second electrodes, on the substrate, after the removing and drying the substrate.

6. The method of claim 5, wherein the light-emitting diode chip is individually encapsulated on the substrate.

7. The method of claim 5, wherein

the separating the light-emitting diode chip from the base substrate comprises separating plural light-emitting diode chips which respectively emit different color lights from each other, from the base substrate, and

a plurality of the light-emitting diode chips is encapsulated on the substrate by a common encapsulation member.

8. The method of claim 1, wherein

the separating the light-emitting diode chip from the base substrate comprises separating plural light-emitting diode chips which respectively emit different color lights from each other, from the base substrate, and

the mounting the light-emitting diode chip comprises mounting a first color light-emitting diode chip on the first and second electrodes,

the method further comprising after the removing and drying the substrate with the first color light-emitting diode chip mounted on the first and second electrodes,

covering the first color light-emitting diode chip mounted on the first and second electrodes by a passivation layer, and

for all other color light-emitting diode chips among the plural light-emitting diode chips, repeatedly performing the disposing the separated light-emitting diode chip in the solution, the applying the negative voltage to the substrate, the mounting the light-emitting diode chip and the removing and drying the substrate.

9. A method of manufacturing a display apparatus, the method comprising:

separating a plurality of light-emitting diode chips having different shapes from each other, respectively from base substrates;

disposing all of the separated plurality of light-emitting diode chips having the different shapes in a solution;

preparing a substrate including a plurality of recesses each of which includes disposed therein a first electrode and a second electrode which is spaced apart from the first electrode to be insulated from the first electrode;

disposing the substrate including the plurality of recesses in which the first and second electrodes are respectively disposed, in the solution, the recesses having different shapes respectively corresponding to the different shapes of the plurality of light-emitting diode chips;

with the separated light-emitting diode chips and the substrate including the plurality of first and second electrodes in the recesses thereof in the solution, applying a negative voltage to the substrate to respectively attract the separated light-emitting diode chips to the plurality of first and second electrodes of the correspondingly shaped recesses of the substrate,

wherein the applying the negative voltage to the substrate comprises applying a first negative voltage to the plurality of first electrodes and applying a second negative voltage to the plurality of second electrodes;

respectively mounting the plurality of light-emitting diode chips attracted to the plurality of first and second electrodes in the recesses having the different shapes, on the plurality of first and second electrodes; and

removing the substrate with the plurality of light-emitting diode chips mounted on the plurality of first and second electrodes from the solution and drying the removed substrate to form the display apparatus.

10. The method of claim 9, wherein from among the separated light-emitting diode chips having different shapes from each other, each light-emitting diode chip is a flip chip comprising a first contact pad and a second contact pad exposed facing a same direction.

11. The method of claim 10, wherein for the respective recesses, the applying the negative voltage to the substrate attracts the first contact pads of the separated light-emitting diode chips to the plurality of first electrodes of the substrate, and attracts the second contact pads of the separated light-emitting diode chips to the second electrodes of the substrate.

12. The method of claim 9, wherein the first negative voltage and the second negative voltage are direct current voltages.

13. The method of claim 9, further comprising encapsulating the plurality of light-emitting diode chips mounted on the plurality of first and second electrodes, on the substrate, after the removing and drying the substrate.

14. The method of claim 13, wherein the plurality of light-emitting diode chips is individually encapsulated on the substrate.

15. The method of claim 13, wherein the plurality of light-emitting diode chips is encapsulated on the substrate by a common encapsulation member.

16. A display apparatus manufactured by the method of claim 9.