Quasi-yagi-type antenna

• US 9,912,071 B2
• Filed: 12/05/2014
• Issued: 03/06/2018
• Est. Priority Date: 01/08/2014
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Diukman, Iddo, Yehezkely, Alon
• Primary Examiner(s): Levi, Dameon E
• Assistant Examiner(s): Lotter, David
• Application Number:
  US14/561,680
• Publication Number:
  US 20150194736A1
• Time in Patent Office: 1,187 Days
• Field of Search: 343818, 343820, 343821
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 1/50 Structural association of antennas with earthing switches, lead-in devices or lightning protectors
• CPC Class Codes: H01Q 19/30 the primary active element being centre-fed and substantially straight, e.g. Yagi antenna
• CPC Class Codes: H01Q 21/0006 Particular feeding systems
• CPC Class Codes: H01Q 21/062 using dipole aerials; H01Q21/067, H01Q21/068 take precedence
• CPC Class Codes: H01Q 9/20 Two collinear substantially straight active elements; Substantially straight single active elements H01Q9/28 takes precedence

Abstract

An apparatus includes a first ground plane, a second ground plane, an antenna, and a balun coupled to the antenna. The balun is disposed between the first ground plane and the second ground plane.

Claims

1. An apparatus comprising:

a first ground plane;

a second ground plane;

an antenna including a dipole portion;

a balun coupled to the dipole portion of the antenna, the balun disposed between the first ground plane and the second ground plane, and at least a portion of the dipole portion of the antenna extended beyond the first ground plane and the second ground plane; and

a plurality of vias that form a reflector between the dipole portion and the balun.

2. The apparatus of claim 1, wherein at least a portion of the antenna is coupled to the balun and is disposed between the first ground plane and the second ground plane.

3. The apparatus of claim 1, further comprising an inner layer between the first ground plane and the second ground plane, the balun disposed in the inner layer.

4. The apparatus of claim 1, the first ground plane coupled to the second ground plane by the plurality of vias.

5. The apparatus of claim 4, the reflector and the dipole portion configured according to a Yagi-type antenna configuration.

6. The apparatus of claim 1, further comprising a surface mount technology (SMT) component mounted on a first surface of the first ground plane, wherein the balun is disposed between a second surface of the first ground plane and the second ground plane, and wherein the second surface is opposite the first surface.

7. The apparatus of claim 1, further comprising an electrical component coupled to the balun, wherein the electrical component comprises a transmission line, an antenna feed, a waveguide, or a combination thereof.

8. The apparatus of claim 1, further comprising a patch antenna coupled to the first ground plane.

9. The apparatus of claim 1, further comprising a patch antenna, wherein the first ground plane is between the patch antenna and the balun.

10. The apparatus of claim 1, the first ground plane coupled to the second ground plane by the plurality of vias, wherein the reflector formed by the plurality of vias includes a grounded via wall reflector and wherein a distance from the dipole portion to the grounded via wall reflector is approximately a quarter-wavelength of a signal to be transmitted.

11. The apparatus of claim 1, further comprising a plurality of antenna elements coupled to a plurality of baluns disposed between the first ground plane and the second ground plane.

12. The apparatus of claim 11, wherein the plurality of antenna elements includes a first set of antenna elements located proximate to a first edge of an inner layer between the first ground plane and the second ground plane and a second set of antenna elements located proximate to a second edge of the inner layer.

13. The apparatus of claim 11, further comprising a third ground plane and a second inner layer between the second ground plane and the third ground plane, and further comprising a second plurality of antenna elements coupled to a second plurality of baluns disposed within the second inner layer.

14. The apparatus of claim 11, further comprising a radio frequency integrated circuit (RFIC) coupled to the first ground plane, the first ground plane between the RFIC and the plurality of baluns, wherein at least one RF chain within the RFIC is coupled to a first antenna element of the plurality of antenna elements.

15. The apparatus of claim 14, wherein multiple RF chains in the RFIC are coupled to multiple antenna elements.

16. A method of communication comprising:

receiving a signal at a balun of an antenna structure, the balun between two ground planes and coupled to a dipole portion of an antenna of the antenna structure, wherein at least a portion of the dipole portion of the antenna is extended beyond the two ground planes and beyond a grounded reflective via wall between the dipole portion and the balun;

generating a phase adjusted signal at an output of the balun; and

radiating the phase adjusted signal via the dipole portion of the antenna.

17. The method of claim 16, further comprising radiating a second signal at a patch antenna, wherein the second signal is independent of the phase adjusted signal, and wherein one of the two ground planes is between the antenna structure and the patch antenna.

18. An apparatus comprising:

means for radiating a signal;

means for generating a phase adjusted signal coupled to the means for radiating;

first means for grounding the means for generating;

second means for grounding the means for generating; and

a plurality of means for reflecting coupled to the first means for grounding and to the second means for grounding, wherein the means for generating is disposed between the first means for grounding and the second means for grounding, and wherein at least a portion of the means for radiating is extended beyond the first means for grounding and the second means for grounding and beyond the plurality of means for reflecting.

19. The apparatus of claim 18, the means for radiating and the plurality of means for reflecting forming a Yagi antenna.

20. The apparatus of claim 19, wherein the plurality of means for reflecting form a via wall coupled to the first means for grounding and to the second means for grounding.