High speed plug

• US 9,912,083 B2
• Filed: 11/25/2015
• Issued: 03/06/2018
• Est. Priority Date: 07/21/2015
• Status: Active Grant

• Current Assignee: Sentinel Connector Systems, Inc.
• Original Assignee: Sentinel Connector Systems, Inc.
• Inventors: Wagner, Justin S.
• Primary Examiner(s): Norris, Jeremy C
• Application Number:
  US14/952,458
• Publication Number:
  US 20170025799A1
• Time in Patent Office: 832 Days
• CPC Class Codes: H01R 12/00 Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures printed connections to, or between, printed circuits H05K1/11
• CPC Class Codes: H01R 12/50 Fixed connections
• CPC Class Codes: H01R 13/6581 Shield structure
• CPC Class Codes: H01R 13/6595 with separate members fixing the shield to the PCB
• CPC Class Codes: H01R 13/6596 the conductive member being a metal grounding panel
• CPC Class Codes: H01R 13/665 with built-in electronic circuit H01R13/70, H01R13/719 take precedence
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H01R 4/2416 the contact members having insulation-cutting edges, e.g. of tuning fork type
• CPC Class Codes: H01R 43/00 Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors of trolley lines B60M1/28
• CPC Class Codes: H01R 43/20 for assembling or disassembling contact members with insulating base, case or sleeve
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/1034 Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]

Abstract

A communication plug including a substrate having a top surface, a bottom surface, opposing side surfaces and opposing end surfaces, a grounding plane in the substrate, a grounding strip on a side surface of the substrate in electrical communication with the grounding plane, where the grounding strip is electrically connected to the ground plane in the substrate.

Claims

1. A communication plug including:

a substrate having a top surface, a bottom surface, opposing side surfaces and opposing end surfaces;

a grounding plane in the substrate;

a grounding strip on a side surface of the substrate in electrical communication with the grounding plane

a plurality of vias arranged in two parallel rows on one opposing end surface and each extending through the substrate;

a plurality of connection pads formed on the top and bottom surface near the opposite end surface of the substrate;

a first set of traces on the top surface extending from a first row of the parallel rows of vias to a respective connection pad on the top surface;

a second set of traces on the bottom surface extending from a second row of the parallel rows of vias to a respective connection pad on the bottom surface,

wherein the grounding strip is electrically connected to the ground plane in the substrate.

2. The communication plug of claim 1 including a plurality of openings in the sides of the substrate.

3. The communication plug of claim 1, wherein each connection pad is formed on the top or bottom surface of the substrate around a wire via.

4. The communication plug of claim 3, wherein the connection pad includes a circular portion extending around the periphery of the wire vias and a triangular portion extending from the circular portion towards an opening in the substrate.

5. The communication plug of claim 3 including a securing unit having a portion inserted into the wire via and a portion covering the connection pad.

6. The communication plug of claim 1 including a second grounding adjacent to the grounding plane in the substrate.

7. A method of forming a communication plug including the steps of:

forming a bottom layer of a substrate;

forming a sub layer on the bottom layer, the sub layer including a first grounding plane;

forming a middle layer on the grounding layer, the middle layer having a grounding plane;

forming a top layer on the substrate;

forming pin vias that are arranged in two parallel rows in the substrate;

forming openings in opposing sides of the substrate;

forming wire vias adjacent to each opening in the substrate;

forming a connection pad surrounding each wire via;

forming a first set of traces on the top layer of the substrate connecting a first row of the two parallel rows of vias to respective connection pads;

forming a second set of traces on a bottom layer of the substrate connecting a second row if the two parallel rows of vias to respective connection pads;

forming a grounding surface on opposite sides of the substrate on the top layer and bottom layer of the substrate, the grounding surface being in electrical communication with the first grounding layer and the second grounding layer.

8. The method of claim 7 including the step of inserting a pin in each pin via.

9. The method of claim 7, wherein the step of forming the connection pad includes the step of forming a circular portion extending around the periphery of the wire vias and forming a triangular portion extending from the circular portion towards an opening in the substrate.

10. The method of claim 9 wherein the step of forming the traces includes forming the traces from each pin via to a corresponding connection pad.

11. The method of claim 7 including the step of inserting the substrate into a plug housing, the plug housing having openings in side surface so of the housing that correspond to the openings formed in the substrate.

12. The method of claim 11 wherein the housing includes a plurality of openings over the pin vias, each opening being sized to accommodate a pin.

13. The method of claim 7 including the step of inserting a pin on a from portion of a securing into each wire via and positioning a lower portion of a securing unit over the connection pad corresponding to the wire via accepting the pin.

14. The method of claim 13 wherein each securing unit secures one wire in electrical communication with a connection pad.