Low cross-talk headset

• US 9,913,021 B1
• Filed: 01/05/2017
• Issued: 03/06/2018
• Est. Priority Date: 01/29/2014
• Status: Active Grant

• Current Assignee: Clear-Com, LLC (HM Electronics Incorporated)
• Original Assignee: Clear-Com, LLC (HM Electronics Incorporated)
• Inventors: Knoblock, Karl
• Primary Examiner(s): Kim, Paul S
• Assistant Examiner(s): Yu, Norman
• Application Number:
  US15/399,644
• Time in Patent Office: 425 Days
• Field of Search: 381330, 381370, 381381, 381 716, 381 74, 381 92, 381 947, 4555752, 379430
• CPC Class Codes: H04R 1/083 Special constructions of mouthpieces
• CPC Class Codes: H04R 1/105 Earpiece supports, e.g. ear hooks for stereophonic headphones H04R5/0335
• CPC Class Codes: H04R 1/1066 Constructional aspects of the interconnection between earpiece and earpiece support earpiece support for monophonic headphones H04R1/105; earpiece support for stereophonic headphones H04R5/0335
• CPC Class Codes: H04R 2201/107 Monophonic and stereophonic headphones with microphone for two-way hands free communication
• CPC Class Codes: H04R 2410/05 Noise reduction with a separate noise microphone
• CPC Class Codes: H04R 2460/01 Hearing devices using active noise cancellation
• CPC Class Codes: H04R 3/002 Damping circuit arrangements for transducers, e.g. motional feedback circuits
• CPC Class Codes: H04R 3/02 for preventing acoustic reaction , i.e. acoustic oscillatory feedback specially adapted for hearing aids H04R25/453

Abstract

A headset for receiving and transmitting audio signals having a frame configured to retain the headset on the user, one or more earphones mounted to the frame of the headset at a first position, one or more microphones mounted to the frame of the headset in a second position separate from the first position, one or more electrical earphones, one or more electrical microphones, wherein the one or more electrical microphone wires are isolated from the one or more electrical earphone wires.

Claims

1. A headset for receiving and transmitting audio signals comprising:

a frame configured to support the headset;

an earphone configured to provide audio signals, wherein the earphone is positioned at a first location adjacent to a first temple of a user during use of the headset;

an electrical earphone wire configured to transfer audio signals to the earphone;

a microphone configured to capture audio signals;

a microphone boom configured to support the microphone, wherein the microphone boom is supported by the frame through a mechanical coupling, wherein the mechanical coupling is positioned at a second location adjacent to a second temple of the user opposite the first temple, and wherein the mechanical coupling is configured such that no earphone is positioned between the microphone boom and the frame of the headset; and

an electrical microphone wire coupled with the microphone, wherein the electrical microphone wire is configured to transfer audio signals,

wherein the electrical microphone wire is physically separated from the electrical earphone wire.

2. The system of claim 1, further comprising one or more dampeners configured to reduce mechanical coupling between the earphone and the frame.

3. The system of claim 1, further comprising one or more dampeners configured to reduce acoustical coupling between the microphone and the frame.

4. The system of claim 1, wherein the electrical microphone wire is not supported by the earphone.

5. The headset of claim 1, wherein the electrical microphone wire and the electrical earphone wire are separate wires.

6. The headset of claim 1, wherein the electrical earphone wire and the electrical microphone wire comprise double-shielded electrical cables configured to reduce transmission of electrical signals between the electrical earphone wire and the electrical microphone wire.

7. The headset of claim 1, wherein the microphone boom comprises a wire-type microphone boom configured to reduce transmission of audio signals from the user through the frame of the headset.

8. The headset of claim 1, wherein the microphone boom comprises a tube-type microphone boom configured to support the electrical microphone wire.

9. The headset of claim 1, further comprising spacers disposed between the electrical microphone wire and the electrical earphone wire, wherein the spacers are configured to reduce electrical coupling between the electrical microphone wire and the electrical earphone wire.

10. The headset of claim 1, further comprising spacers disposed between the electrical microphone wire and the electrical earphone wire, wherein the spacers are configured to reduce acoustical coupling between the electrical microphone wire and the electrical earphone wire.

11. The headset of claim 1, further comprising spacers disposed between the electrical microphone wire and the electrical earphone wire, wherein the spacers are configured to reduce mechanical coupling between the electrical microphone wire and the electrical earphone wire.

12. The headset of claim 1, further comprising one or more physical processors configured to by machine-readable instructions to:

reduce the audio signals that are transmitted from the electrical earphone wire to the electrical microphone wire.

13. The headset of claim 12, wherein the one or more physical processors are configured to reduce the audio signals that are transmitted from the earphone through the frame of the headset to the microphone.