Computer thermal system

• US 9,913,400 B2
• Filed: 05/26/2015
• Issued: 03/06/2018
• Est. Priority Date: 06/07/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Degner, Brett W., Prather, Eric R., Narajowski, David H., Liang, Frank F., Nigen, Jay S., Dybenko, Jesse T., Duke, Connor R., Whang, Eugene A., Stringer, Christopher J., Banko, Joshua D., Kalinowski, Caitlin Elizabeth, Berk, Jonathan L., Casebolt, Matthew P., Fetterman, Kevin S., Weirshauser, Eric J.
• Primary Examiner(s): PAPE, ZACHARY
• Application Number:
  US14/721,857
• Publication Number:
  US 20150253822A1
• Time in Patent Office: 1,015 Days
• Field of Search: 24458, 24459, 24453, 411 41, 411 45, 257718-719
• CPC Class Codes: G02B 6/0001 specially adapted for lighting devices or systems lighting or signalling on vehicles using light guides B60Q1/00; lighting devices for vehicle dashboards B60Q3/10; lighting devices for vehicle interior using light guides B60Q3/62; lighting devices mounted on the vehicle rear part using light guides F21S43/235; measuring arrangements having light conducting pointers G01D13/265; illumination of liquid crystal displays G02F1/1336; illuminated signs G09F13/00
• CPC Class Codes: G02B 6/0008 the light being emitted at the end of the fibre
• CPC Class Codes: G02B 6/001 the light being emitted along at least a portion of the lateral surface of the fibre
• CPC Class Codes: G06F 1/181 Enclosures for portable computers G06F1/1613
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: G06F 1/183 Internal mounting support structures, e.g. for printed circuit boards, internal connecting means for buses G06F13/409
• CPC Class Codes: G06F 1/185 Mounting of expansion boards
• CPC Class Codes: G06F 1/188 Mounting of power supply units
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G06F 3/00 Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
• CPC Class Codes: G08B 21/18 Status alarms G08B21/02 takes precedence
• CPC Class Codes: G08B 5/36 using visible light sources
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 5/03 Covers
• CPC Class Codes: H05K 7/20009 using a gaseous coolant in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954
• CPC Class Codes: H05K 7/20145 Means for directing air flow, e.g. ducts, deflectors, plenum or guides
• CPC Class Codes: H05K 7/20154 Heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20163 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
• CPC Class Codes: H05K 7/20172 : Fan mounting or fan specifications
• CPC Class Codes: H05K 7/20209 : Thermal management, e.g. fan control
• CPC Class Codes: H05K 7/2039 : characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/2049 : Pressing means used to urge contact, e.g. springs

Abstract

The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

Claims

1. A consolidated thermal module used to uniformly secure electrical contacts of an integrated circuit (IC) to corresponding electrical contacts of an electrical connector disposed on a first surface of a printed circuit board (PCB) and to maintain the IC in uniform thermal contact with a heat transfer assembly, the consolidated thermal module positioned at a second surface of the PCB, the second surface opposite the first surface, the consolidated thermal module comprising:

a stiffener plate disposed on the second surface of the PCB;

a retaining mechanism in mechanical contact with the stiffener plate and disposed on the second surface of the PCB and comprising;

a first spring assembly capable of generating a first retaining force and secured to the IC and the heat transfer assembly by first fasteners symmetrically disposed about first midpoint of the first spring assembly such that the first retaining force is uniformly applied to the first fasteners, and

a second spring assembly capable of generating a second retaining force and in uniform and direct mechanical contact with the stiffener plate and secured to the IC and the heat transfer assembly by second fasteners symmetrically disposed about a second midpoint of the second spring assembly such that the second retaining force is uniformly applied to the second fasteners and wherein the first and second spring assemblies communicate with each other by way of a transverse member at a midline of the retaining mechanism such that the first and second retaining forces are applied uniformly to the stiffener plate.

2. The consolidated thermal module as recited in claim 1, wherein the retaining mechanism includes a first spring and a second spring.

3. The consolidated thermal module as recited in claim 2, wherein the first spring comprises a first portion configured to provide the first retaining force and the second spring comprises a second portion configured to provide the second retaining force.

4. The consolidated thermal module as recited in claim 1, wherein the PCB is disposed within an internal volume that is enclosed and defined by an interior surface of a housing of a compact desktop computer, the housing characterized as having a longitudinal axis, and wherein the internal volume is symmetric about the longitudinal axis.

5. The consolidated thermal module as recited in claim 4, wherein the heat transfer assembly comprises a heat sink asymmetrically disposed within the internal volume and having heat sink walls that cooperate to give the heat sink an overall triangular cross section that is perpendicular to the longitudinal axis.

6. The consolidated thermal module as recited in claim 5, wherein the IC is a computing component disposed within the internal volume and supported by and in thermal contact with the heat sink.

7. The consolidated thermal module as recited in claim 6, wherein exterior surfaces of the heat sink walls and the interior surface of the housing defines a peripheral thermal zone separate from a central thermal zone.

8. The consolidated thermal module as recited in claim 7, further comprising an air mover arranged to move an incoming airflow received at a first opening of the housing through the internal volume and along an airflow path parallel to the longitudinal axis.

9. The consolidated thermal module as recited in claim 8, further comprising an air splitter arranged to split the incoming airflow into a central airflow that follows a central airflow path through the central thermal zone and substantially parallel to the longitudinal axis.

10. The consolidated thermal module as recited in claim 9, wherein the air splitter is arranged to split the incoming airflow into a peripheral airflow independent of the central airflow that follows a peripheral airflow path through the peripheral thermal zone and substantially parallel to the longitudinal axis.

11. The consolidated thermal module as recited in claim 9, wherein the air mover combines the peripheral airflow and the central airflow into an exhaust airflow prior to moving the exhaust airflow out of the housing.

12. The consolidated thermal module as recited in claim 8, wherein the air mover comprises:

an impeller comprising a plurality of fan blades; and

an air exhaust grill surrounding the impeller and comprising a plurality of air vents through which the exhaust airflow moves, the plurality of air vents comprising;

a plurality of ribs configured to cooperate with the plurality of fan blades to increase an axial component of the exhaust airflow, and

a plurality of stators configured to remove tangential components of the exhaust airflow passing through the air exhaust grill.

13. The consolidated thermal module as recited in claim 5, wherein at least one of the heat sink walls comprises an exterior surface that carries the IC.

14. The consolidated thermal module as recited in claim 4, wherein the housing has a thickness that varies uniformly from a first thickness at an opening to a reduced thickness an axial distance from the opening.