Shielding structures for system-in-package assemblies in portable electronic devices
First Claim
1. An electronic device, comprising:
- a substrate; and
a system in package assembly including;
a plurality of components mounted on the substrate,one or more subsystems, each subsystem including two or more of the plurality of components, each subsystem separated from an adjacent subsystem by one of a plurality of trenches,wherein the plurality of trenches has angled walls, andcomponents included in the subsystem with second profiles, the second profiles being higher than the first profiles,a first shielding layer covering a top surface of the one or more subsystems, anda plurality of second shielding layers, wherein each second shielding layer is a single layer of shielding material that substantially fills a volume between walls of one of the plurality of trenches,a plurality of insulators disposed between the one or more subsystems, each insulator separated from another insulator by one of the plurality of trenches, andwherein the first shielding layer includes a material different from the plurality of second shielding layers,wherein the first shielding layer covers a top surface of each of the plurality of second shielding layers.
1 Assignment
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Accused Products
Abstract
A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer. In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.
46 Citations
16 Claims
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1. An electronic device, comprising:
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a substrate; and a system in package assembly including; a plurality of components mounted on the substrate, one or more subsystems, each subsystem including two or more of the plurality of components, each subsystem separated from an adjacent subsystem by one of a plurality of trenches, wherein the plurality of trenches has angled walls, and components included in the subsystem with second profiles, the second profiles being higher than the first profiles, a first shielding layer covering a top surface of the one or more subsystems, and a plurality of second shielding layers, wherein each second shielding layer is a single layer of shielding material that substantially fills a volume between walls of one of the plurality of trenches, a plurality of insulators disposed between the one or more subsystems, each insulator separated from another insulator by one of the plurality of trenches, and wherein the first shielding layer includes a material different from the plurality of second shielding layers, wherein the first shielding layer covers a top surface of each of the plurality of second shielding layers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification