System architecture for combined static and pass-by processing
First Claim
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1. A system for processing substrates, comprising:
- a loading chamber for introducing substrates from atmospheric environment into vacuum environment;
a loading arrangement for loading substrates onto substrate carriers inside the vacuum environment;
a heating chamber forming a static processing chamber for heating the substrate while the carrier is stationary;
a pass-by processing chamber attached to the heating chamber and having a transport section and a processing section, wherein the transport section is wider than width of the substrate, such that an entering carrier from the heating chamber can be accommodated within the pass-by processing chamber before a sputtering process is completed in the processing section on an entire surface of the prior substrate;
a transport mechanism configured to transport the carrier in the transport section at a transport speed until the carrier catches-up with another carrier that is already being processed in the processing section of the pass-by processing chamber, and to transport the carrier in the processing section at a pass-by speed, wherein the transport speed is faster than the pass-by speed;
a loading lifter arrangement configured to load substrates into the loading chamber;
an unloading lifter arrangement configured to remove substrates from the loading chamber;
wherein each of the loading lifter and unloading lifter arrangements comprises;
a retractable blade housing having a vacuum sealing plate at an upper end thereof;
a lifting blade movable inside the retractable blade housing; and
,a vertical motion mechanism coupled to the retractable blade housing and the lifting blade and vertically moving the retractable blade housing and the lifting blade.
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Abstract
Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.
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Citations
15 Claims
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1. A system for processing substrates, comprising:
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a loading chamber for introducing substrates from atmospheric environment into vacuum environment; a loading arrangement for loading substrates onto substrate carriers inside the vacuum environment; a heating chamber forming a static processing chamber for heating the substrate while the carrier is stationary; a pass-by processing chamber attached to the heating chamber and having a transport section and a processing section, wherein the transport section is wider than width of the substrate, such that an entering carrier from the heating chamber can be accommodated within the pass-by processing chamber before a sputtering process is completed in the processing section on an entire surface of the prior substrate; a transport mechanism configured to transport the carrier in the transport section at a transport speed until the carrier catches-up with another carrier that is already being processed in the processing section of the pass-by processing chamber, and to transport the carrier in the processing section at a pass-by speed, wherein the transport speed is faster than the pass-by speed; a loading lifter arrangement configured to load substrates into the loading chamber; an unloading lifter arrangement configured to remove substrates from the loading chamber; wherein each of the loading lifter and unloading lifter arrangements comprises; a retractable blade housing having a vacuum sealing plate at an upper end thereof; a lifting blade movable inside the retractable blade housing; and
,a vertical motion mechanism coupled to the retractable blade housing and the lifting blade and vertically moving the retractable blade housing and the lifting blade. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A linear system for processing substrates in vacuum, comprising:
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a first linear arrangement of chambers, the first linear arrangement maintaining vacuum environment and having passages enabling substrate carriers to move from one chamber directly to the next in a first traveling direction; a second linear arrangement of chambers, the second linear arrangement maintaining vacuum environment and having passages enabling substrate carriers to move from one chamber directly to the next in a second traveling direction opposite the first traveling direction; a loading chamber positioned at entry side of the first linear arrangement and configured to introduce substrates from atmospheric environment into the vacuum environment maintained by the first linear chamber arrangement; an unloading chamber positioned at exit side of the second linear arrangement and configured to remove substrates from the vacuum environment maintained by the second linear chamber arrangement out to atmospheric environment; a turning chamber connected to exit side of the first linear arrangement and to entry side of the second linear arrangement and configured to accept substrate carriers from the first linear arrangement and deliver the substrate carriers to the second linear arrangement; a loading lifter configured to load substrates into the loading chamber; an unloading lifter configured to remove substrates from the unloading chamber; wherein each of the loading lifter and unloading lifter comprises; a retractable blade housing having a vacuum sealing plate at an upper end thereof; a lifting blade movable inside the retractable blade housing; and
,a vertical motion mechanism coupled to the retractable blade housing and the lifting blade and vertically moving the retractable blade housing and the lifting blade. - View Dependent Claims (12, 13, 14, 15)
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Specification