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System architecture for combined static and pass-by processing

  • US 9,914,994 B2
  • Filed: 12/27/2012
  • Issued: 03/13/2018
  • Est. Priority Date: 12/27/2011
  • Status: Active Grant
First Claim
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1. A system for processing substrates, comprising:

  • a loading chamber for introducing substrates from atmospheric environment into vacuum environment;

    a loading arrangement for loading substrates onto substrate carriers inside the vacuum environment;

    a heating chamber forming a static processing chamber for heating the substrate while the carrier is stationary;

    a pass-by processing chamber attached to the heating chamber and having a transport section and a processing section, wherein the transport section is wider than width of the substrate, such that an entering carrier from the heating chamber can be accommodated within the pass-by processing chamber before a sputtering process is completed in the processing section on an entire surface of the prior substrate;

    a transport mechanism configured to transport the carrier in the transport section at a transport speed until the carrier catches-up with another carrier that is already being processed in the processing section of the pass-by processing chamber, and to transport the carrier in the processing section at a pass-by speed, wherein the transport speed is faster than the pass-by speed;

    a loading lifter arrangement configured to load substrates into the loading chamber;

    an unloading lifter arrangement configured to remove substrates from the loading chamber;

    wherein each of the loading lifter and unloading lifter arrangements comprises;

    a retractable blade housing having a vacuum sealing plate at an upper end thereof;

    a lifting blade movable inside the retractable blade housing; and

    ,a vertical motion mechanism coupled to the retractable blade housing and the lifting blade and vertically moving the retractable blade housing and the lifting blade.

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