Optical die to database inspection
First Claim
1. A system configured to detect defects on a wafer, comprising:
- an optical inspection subsystem comprising at least a light source and a detector, wherein the light source is configured to generate light that is directed to a wafer, and wherein the detector is configured to detect light from the wafer and to generate images responsive to the detected light; and
one or more computer subsystems configured for;
generating a rendered image based on information for a design printed on the wafer, wherein the rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer, wherein generating the rendered image comprises one or more steps, and wherein the one or more computer subsystems are further configured for performing at least one of the one or more steps by executing a generative model;
comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem, wherein the design is printed on the wafer using a reticle; and
detecting defects on the wafer based on results of the comparing.
1 Assignment
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Accused Products
Abstract
Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer. Generating the rendered image includes one or more steps, and the computer subsystem(s) are configured for performing at least one of the one or more steps by executing a generative model. The computer subsystem(s)) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.
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Citations
35 Claims
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1. A system configured to detect defects on a wafer, comprising:
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an optical inspection subsystem comprising at least a light source and a detector, wherein the light source is configured to generate light that is directed to a wafer, and wherein the detector is configured to detect light from the wafer and to generate images responsive to the detected light; and one or more computer subsystems configured for; generating a rendered image based on information for a design printed on the wafer, wherein the rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer, wherein generating the rendered image comprises one or more steps, and wherein the one or more computer subsystems are further configured for performing at least one of the one or more steps by executing a generative model; comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem, wherein the design is printed on the wafer using a reticle; and detecting defects on the wafer based on results of the comparing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A non-transitory computer-readable medium, storing program instructions executable on a computer system for performing a computer-implemented method for detecting defects on a wafer, wherein the computer-implemented method comprises:
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generating a rendered image based on information for a design printed on a wafer, wherein the rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer, wherein the optical inspection subsystem comprises at least a light source and a detector, wherein the light source is configured to generate light that is directed to the wafer, wherein the detector is configured to detect light from the wafer and to generate images responsive to the detected light, wherein generating the rendered image comprises one or more steps, and wherein at least one of the one or more steps is performed by executing a generative model; comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem, wherein the design is printed on the wafer using a reticle; and detecting defects on the wafer based on results of the comparing, wherein said generating, said comparing, and said detecting are performed by one or more computer subsystems.
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35. A computer-implemented method for detecting defects on a wafer, comprising:
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generating a rendered image based on information for a design printed on a wafer, wherein the rendered image is a simulation of an image generated by an optical inspection subsystem for the design printed on the wafer, wherein the optical inspection subsystem comprises at least a light source and a detector, wherein the light source is configured to generate light that is directed to the wafer, wherein the detector is configured to detect light from the wafer and to generate images responsive to the detected light, wherein generating the rendered image comprises one or more steps, and wherein at least one of the one or more steps is performed by executing a generative model; comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem, wherein the design is printed on the wafer using a reticle; and detecting defects on the wafer based on results of the comparing, wherein said generating, said comparing, and said detecting are performed by one or more computer subsystems.
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Specification