Systems and methods for flexible components for powered cards and devices

• US 9,916,992 B2
• Filed: 02/19/2013
• Issued: 03/13/2018
• Est. Priority Date: 02/20/2012
• Status: Active Grant

• Current Assignee: Dynamics Inc.
• Original Assignee: Dynamics Inc.
• Inventors: Mullen, Jeffrey D., O'Shea, Norman E.
• Primary Examiner(s): Patel, Reema
• Assistant Examiner(s): GHEYAS, SYED I
• Application Number:
  US13/770,484
• Publication Number:
  US 20130217152A1
• Time in Patent Office: 1,848 Days
• Field of Search: 438 5, 438107, 438127, 438800, 257 99, 257100, 257 98, 257678, 257741, 257777, 257784, 257E21509, 257E23141, 257E25013
• CPC Class Codes: G11B 5/00808 magnetic cards
• CPC Class Codes: H01L 21/02 Manufacture or treatment of semiconductor devices or of parts thereof
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 22/10 Measuring as part of the manufacturing process burn-in G01R31/2855
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2203/049 Wire bonding

Abstract

Die may be thinned using a thinning and/or a polishing process. Such thinned die may be flexible and may change operational characteristics when flexed. The flexible die may be applied to a mechanical carrier (e.g., a PCB) of a card or device. Detection circuitry may also be provided on the PCB and may be used to detect changed operational characteristics. Such detection circuitry may cause a reaction to the changed characteristics by controlling other components on the card or device based upon the flex-induced changed characteristics. The thinned die may be stacked, interconnected, and encapsulated between sheets of laminate material to form a flexible card or device.

Claims

1. A method, comprising:

reducing a thickness of a raw die;

rolling said raw die onto a reel for storage, wherein a bend radius of said raw die on said real is greater than a minimum bend radius of a carrier on said reel;

retrieving said raw die from said reel as part of a pick-and-place operation; and

placing said retrieved raw die onto a carrier of a flexible device as part of said pick-and-place operation.

2. The method of claim 1, wherein said raw die is reduced in thickness to between approximately 0.00025 inches and 0.010 inches.

3. The method of claim 1, wherein said raw die is reduced in thickness to approximately 0.004 inches.

4. The method of claim 1, wherein said raw die is rolled onto said reel at about a maximum bend angle of said raw die.

5. A method, comprising:

placing a reduced thickness raw die onto a PCB;

flexing said PCB;

monitoring said raw die for changed operation based on said flexing; and

changing an operation of a component on said PCB based on said changed operation.