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Method and apparatus for maintaining operational temperature of an integrated circuit

  • US 9,917,028 B2
  • Filed: 09/10/2012
  • Issued: 03/13/2018
  • Est. Priority Date: 09/09/2011
  • Status: Active Grant
First Claim
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1. A temperature-controlled integrated circuit device, comprising:

  • a substrate having an upper surface;

    a secure element positioned on the substrate upper surface, the secure element configured to perform secure data processing within a nominal operating temperature range;

    a heat-transfer element positioned on the substrate upper surface, the heat-transfer element in thermal communication with the secure element and configured to transfer heat to the secure element; and

    a potting compound disposed on the substrate upper surface, the potting compound in communication with the secure element and the heat-transfer element, the potting compound substantially covering at least one of the secure element and the heat-transfer element;

    wherein the heat-transfer element enables the thermal communication between the secure element and the heat-transfer element by thermal conduction, thereby allowing the secure element to operate in an extended temperature range beyond the nominal operating temperature range; and

    wherein the heat-transfer element and the secure element are in surface contact.

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