Method and apparatus for maintaining operational temperature of an integrated circuit

• US 9,917,028 B2
• Filed: 09/10/2012
• Issued: 03/13/2018
• Est. Priority Date: 09/09/2011
• Status: Active Grant

• Current Assignee: Assa Abloy AB
• Original Assignee: Assa Abloy AB
• Inventors: Padilla, Toby Mark, Verwiebe, Martin, Milbrandt, Ryan Neal, Bousfield, Randall Dennis
• Primary Examiner(s): Paik, Sang Y
• Application Number:
  US13/607,981
• Publication Number:
  US 20130062331A1
• Time in Patent Office: 2,010 Days
• Field of Search: 219209, 32475003
• CPC Class Codes: H01L 23/345 Arrangements for heating thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A temperature-controlled integrated circuit configured with a secure data processing element, and method of manufacture of same, is disclosed. Specifically, the temperature-controlled integrated circuit, comprising a secure data processing element operable within a nominal operating range, is configured with a heat-transfer element which allows the secure data processing element to operate in an extended operating range.

Claims

1. A temperature-controlled integrated circuit device, comprising:

a substrate having an upper surface;

a secure element positioned on the substrate upper surface, the secure element configured to perform secure data processing within a nominal operating temperature range;

a heat-transfer element positioned on the substrate upper surface, the heat-transfer element in thermal communication with the secure element and configured to transfer heat to the secure element; and

a potting compound disposed on the substrate upper surface, the potting compound in communication with the secure element and the heat-transfer element, the potting compound substantially covering at least one of the secure element and the heat-transfer element;

wherein the heat-transfer element enables the thermal communication between the secure element and the heat-transfer element by thermal conduction, thereby allowing the secure element to operate in an extended temperature range beyond the nominal operating temperature range; and

wherein the heat-transfer element and the secure element are in surface contact.

2. The device of claim 1, further comprising a conductive element disposed on the substrate upper surface, the conductive element enabling the thermal communication between the secure element and the heat-transfer element.

3. The device of claim 2, wherein the material of the conductive element is selected from the group consisting of copper, aluminum, titanium, tungsten, silicon carbide, a conductive epoxy, a conductive polymer and a metal.

4. The device of claim 2, wherein the heat-transfer element comprises a surface mount resistor.

5. The device of claim 2, further comprising a general purpose processor in communication with the secure element, wherein the heat-transfer element comprises a surface mount resistor and wherein the heat-transfer element is configured to generate heat in response to at least one of an atmospheric temperature adjacent the device, a temperature measured on the device and a state of the communication between the secure element and the general purpose processor.

6. The device of claim 2, wherein the device is configured to operate as an access control reader.

7. The device of claim 2, wherein the extended temperature range comprises a temperature at or below 0 degrees Celsius.

8. The device of claim 1, further comprising a general purpose processor in communication with the secure element, wherein the heat-transfer element comprises a surface mount resistor and wherein the heat-transfer element is configured to generate heat in response to at least one of an atmospheric temperature adjacent the device, a temperature measured on the device and a state of the communication between the secure element and the general purpose processor.

9. The device of claim 1, wherein the heat-transfer element comprises a surface mount resistor.

10. The device of claim 9, further comprising a general purpose processor in communication with the secure element, wherein the heat-transfer element is configured to generate heat in response to at least one of an atmospheric temperature adjacent the device, a temperature measured on the device and a state of the communication between the secure element and the general purpose processor.

11. A temperature-controlled integrated circuit system comprising a conductive element mounted on a substrate and which contains a secure element and a heat-transfer element disposed thereof, the secure element configured to perform secure data processing within a nominal operating temperature range, the conductive element providing thermal conduction between the heat-transfer element and the secure element;

a potting compound substantially and completely disposed over at least one of the heat-transfer element and the secure element; and

a general purpose processor in communication with the secure element;

wherein the heat-transfer element comprises a surface mount resistor;

wherein the heat-transfer element is configured to generate heat in response to at least one of an atmospheric temperature adjacent the device, a temperature measured on the device and a state of the communication between the secure element and the general purpose processor;

wherein the thermal conduction between the heat-transfer element and the secure element allows the secure element to operate in an extended temperature range beyond the nominal operating temperature range;

wherein the system is configured to operate in an access control reader environment; and

wherein the conductive element and the secure element are in direct physical contact by way of a shared surface.

12. A method for temperature control of an integrated circuit system, comprising the steps of:

exposing a temperature-controlled integrated circuit system to an extended temperature range comprising a temperature at or below 0 degrees Celsius, the integrated circuit system comprising a conductive element mounted on a substrate and which contains a secure element and a heat-transfer element disposed thereof, the secure element configured to perform secure data processing within a nominal operating temperature range, the conductive element providing thermal communication between the heat-transfer element and the secure element, a potting compound disposed substantially over at least one of the heat-transfer element and the secure element, wherein the thermal communication between the heat-transfer element and the secure element is thermal conduction and allows the secure element to operate in an extended temperature range beyond the nominal operating temperature range;

determining that the integrated circuit system requires heating;

activating a heat-transfer element; and

providing heat to at least a portion of the integrated circuit system to allow the integrated circuit system to operate in the extended temperature range beyond the nominal operating temperature range,

wherein the step of providing heat to at least a portion of the integrated circuit system is enabled by the conductive element, the conductive element enabling the thermal communication between the secure element and the heat-transfer element disposed thereof; and

wherein the conductive element and the secure element are in direct physical contact.

13. The method of claim 12, the integrated circuit system further comprising a general purpose processor in communication with the secure element, wherein the step of determining that the integrated circuit system requires heating comprises receiving an input from a sensor that senses at least one of an atmospheric temperature adjacent the system, a temperature measured on the system and a state of the communication between the secure element and the general purpose processor.