Power module assembly with reduced inductance

• US 9,917,065 B1
• Filed: 09/09/2016
• Issued: 03/13/2018
• Est. Priority Date: 09/09/2016
• Status: Expired due to Fees

• Current Assignee: GM Global Technology Operations LLC (General Motors Company)
• Original Assignee: GM Global Technology Operations LLC (General Motors Company)
• Inventors: Ward, Terence G., Stancu, Constantin C., Jaksic, Marko, Mann, Brooks S.
• Primary Examiner(s): Clark, S. V.
• Application Number:
  US15/260,858
• Publication Number:
  US 20180076153A1
• Time in Patent Office: 550 Days
• Field of Search: 257691, 257758, 257750
• CPC Class Codes: H01L 2023/4087 Mounting accessories, interposers, clamping or screwing parts
• CPC Class Codes: H01L 2224/48096 the kinked part being in proximity to the bonding area on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/48097 the kinked part being in proximity to the bonding area outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other

Abstract

A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.

Claims

1. A power module assembly comprising:

a plurality of electrically conducting layers including a first layer and a third layer;

one or more electrically insulating layers operatively connected to each of the plurality of electrically conducting layers;

wherein the one or more electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers;

wherein the first layer is configured to carry a first current flowing in a first direction;

wherein the third layer is configured to carry a second current flowing in a second direction opposite to the first direction;

wherein the first, second, third, fourth and fifth layers are configured to be thermally conducting such that heat from the first layer is conducted to the fifth layer, via each of the second, third and fourth layers; and

wherein the fifth layer includes a plurality of pins configured to dissipate the heat.

2. The assembly of claim 1, wherein:

the plurality of electrically conducting layers includes a fifth layer; and

the one or more electrically insulating layers include a fourth layer positioned between and configured to electrically isolate the third and the fifth layers.

3. The assembly of claim 2, wherein the first, the third and the fifth layers are each composed of at least one of aluminum and copper.

4. The assembly of claim 2, wherein the second and the fourth layers are each composed of aluminum nitride.

5. The assembly of claim 2, wherein:

the first, second, third, fourth and fifth layers each define a first, second, third, fourth and fifth width, W₁, W₂, W₃, W₄, W₅, respectively; and

the first, second, third, fourth and fifth widths increase in ascending order, with the first width being the smallest width, W₁<

W₂<

W₃<

W₄<

W₅.

6. The assembly of claim 1, wherein:

the second layer includes multiple sides;

the first and second layers are centered at a first height (h₁) and a second height (h₂), respectively, from a reference level;

the third layer includes a base portion centered at a third height (h₃) from the reference level, a first wrapping portion centered at the first height (h₁) and a second wrapping portion centered at the second height (h₂) from the reference level; and

the first and second wrapping portions are configured to wrap around at least one of the multiple sides of the second layer.

7. The assembly of claim 6, wherein:

the first and second wrapping portions are configured to wrap around the second layer in at least three directions.

8. The assembly of claim 1, further comprising:

a plurality of flexible circuits operatively connected to the first layer;

wherein each of the plurality of flexible circuits includes a respective drain, gate and source flexible member placed in proximity; and

wherein the respective drain, gate and source flexible members are electrically isolated from one another.

9. The assembly of claim 1, wherein:

the first layer includes a first conducting member and a second conducting member each centered at a first height (h₁) from a reference level; and

the first and second conducting members are spaced from one another in a direction perpendicular to the first height, the first conducting member being electrically isolated relative to the second conducting member.

10. The assembly of claim 1, further comprising:

a plurality of capacitors operatively connected to the first layer;

a single bus bar operatively connected to each of the plurality of capacitors; and

wherein the single bus bar includes a first terminal and a second terminal, the first terminal being of opposite polarity relative to the second terminal.

11. The assembly of claim 1, further comprising:

a clamp operatively connected to the fifth layer and extending around an entire perimeter of the fifth layer, the clamp being configured to provide a uniform clamp load on the fifth layer.

12. A power module assembly comprising:

a plurality of electrically conducting layers including a first, a third and a fifth layer;

one or more electrically insulating layers operatively connected to each of the plurality of electrically conducting layers;

wherein the one or more electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers;

wherein the one or more electrically insulating layers include a fourth layer positioned between and configured to electrically isolate the third and the fifth layers;

wherein the first layer is configured to carry a first current flowing in a first direction;

wherein the third layer is configured to carry a second current flowing in a second direction opposite to the first direction;

wherein the first and second layers are centered at a first height (h₁) and a second height (h₂), respectively, from a reference level;

wherein the third layer includes a base portion centered at a third height (h₃) from the reference level, a first wrapping portion centered at the first height (h₁) and a second wrapping portion centered at the second height (h₂) from the reference level; and

wherein the second layer includes multiple sides, the first and second wrapping portions being configured to wrap around at least one of the multiple sides of the second layer.

13. The assembly of claim 12, further comprising:

a plurality of flexible circuits operatively connected to the first layer and configured to provide low inductance for gate control and measurement loops;

wherein each of the plurality of flexible circuits includes a respective drain, gate and source flexible member placed in proximity; and

wherein the respective drain, gate and source flexible members are electrically isolated from one another.

14. The assembly of claim 12, wherein:

the first layer includes a first conducting member and a second conducting member each centered at a first height (h₁) from a reference level;

the first and second conducting members are spaced from one another in a direction perpendicular to the first height, the first conducting member being electrically isolated relative to the second conducting member;

wherein the assembly is configured to support a high switching frequency operation of at least 75 kHz; and

further comprising;

a plurality of power dies operatively connected to the first layer, the plurality of power dies including reverse conducting dies.

15. The assembly of claim 12, further comprising:

a plurality of capacitors operatively connected to the first layer;

a single bus bar operatively connected to each of the plurality of capacitors;

a plurality of power dies operatively connected to the first layer; and

wherein the single bus bar includes a first terminal and a second terminal, the first terminal being of opposite polarity relative to the second terminal.

16. The assembly of claim 15, further comprising:

a clamp operatively connected to the fifth layer and extending around an entire perimeter of the fifth layer, the clamp being configured to provide a uniform clamp load on the fifth layer; and

wherein the plurality of power dies includes reverse conducting wide band gap semiconductor dies.

17. The assembly of claim 12, wherein:

the first, second, third, fourth and fifth layers are configured to be thermally conducting such that heat from the first layer is conducted to the fifth layer, via each of the second, third and fourth layers;

the fifth layer includes a plurality of pins configured to dissipate the heat; and

the third layer and the fourth layer extend sufficiently close to an edge of the fifth layer so as to provide structural support beyond the plurality of pins.

18. A power module assembly comprising:

a plurality of electrically conducting layers including a first layer and a third layer;

one or more electrically insulating layers operatively connected to each of the plurality of electrically conducting layer;

wherein the one or more electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers;

a clamp operatively connected to the fifth layer and extending around an entire perimeter of the fifth layer, the clamp being configured to provide a uniform clamp load on the fifth layer;

wherein the first layer is configured to carry a first current flowing in a first direction; and

wherein the third layer is configured to carry a second current flowing in a second direction opposite to the first direction.

19. The assembly of claim 18, further comprising:

a plurality of capacitors operatively connected to the first layer;

a single bus bar operatively connected to each of the plurality of capacitors; and

wherein the single bus bar includes a first terminal and a second terminal, the first terminal being of opposite polarity relative to the second terminal.

20. The assembly of claim 18, further comprising:

a plurality of flexible circuits operatively connected to the first layer;

wherein each of the plurality of flexible circuits includes a respective drain, gate and source flexible member placed in proximity; and

wherein the respective drain, gate and source flexible members are electrically isolated from one another.