Memory cell structure for improving erase speed

• US 9,917,165 B2
• Filed: 05/15/2015
• Issued: 03/13/2018
• Est. Priority Date: 05/15/2015
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Wu, Chang-Ming, Liu, Shih-Chang
• Primary Examiner(s): Malek, Maliheh
• Application Number:
  US14/713,462
• Publication Number:
  US 20160336415A1
• Time in Patent Office: 1,033 Days
• CPC Class Codes: H01L 29/40114 the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
• CPC Class Codes: H01L 29/42328 with at least one additional gate other than the floating gate and the control gate, e.g. program gate, erase gate or select gate
• CPC Class Codes: H01L 29/66825 with a floating gate H01L29/6684 takes precedence
• CPC Class Codes: H01L 29/788 with floating gate H01L29/78391 takes precedence
• CPC Class Codes: H10B 41/35 with a cell select transistor, e.g. NAND

Abstract

A split-gate flash memory cell for improved erase speed is provided. An erase gate and a floating gate are laterally spaced over a semiconductor substrate. The floating gate has a height increasing towards the erase gate, a concave sidewall surface neighboring the erase gate, and a tip defined an interface of the concave sidewall surface and an upper surface of the floating gate. A control gate and a sidewall spacer are arranged over the upper surface of the floating gate. The control gate is laterally offset from the tip of the floating gate, and the sidewall spacer is laterally arranged between the control gate and the tip. A method for manufacturing the split-gate flash memory cell is also provided.

Claims

1. A split-gate flash memory cell, comprising:

an erase gate and a floating gate laterally spaced over a semiconductor substrate, wherein the floating gate has a height increasing towards the erase gate, a concave sidewall surface neighboring the erase gate, a tip defined at an interface of the concave sidewall surface and an upper surface of the floating gate, and an additional sidewall surface on an opposite side of the floating gate as the concave sidewall surface, wherein the concave sidewall surface has a midpoint between a top edge of the concave sidewall surface and a bottom edge of the concave sidewall surface, wherein the top and bottom edges are farther from the additional sidewall surface than the midpoint is, wherein the erase gate has a width-wise bulge at a bottom of the erase gate, wherein the erase gate has a substantially uniform width from a top of the erase gate to a top of the width-wise bulge, and wherein the erase gate has a variable width greater than or equal to the substantially uniform width from the top of the width-wise bulge to a bottom of the erase gate; and

a control gate and a sidewall spacer arranged over the upper surface of the floating gate, wherein the control gate is laterally offset from the tip of the floating gate, and wherein the sidewall spacer is laterally arranged between the control gate and the tip.

2. The split-gate flash memory cell according to claim 1, wherein the height of the floating gate is substantially uniform from the additional sidewall surface to a point laterally offset from the additional sidewall surface, and wherein the height of the floating gate increases from the point to the tip.

3. The split-gate flash memory cell according to claim 1, wherein the additional sidewall surface is substantially planar.

4. The split-gate flash memory cell according to claim 1, wherein the floating gate has an asymmetric profile along an axis bisecting the upper surface of the floating gate.

5. The split-gate flash memory cell according to claim 1, further comprising:

a tunneling dielectric layer arranged between the erase gate and the floating gate, and between the erase gate and the sidewall spacer.

6. The split-gate flash memory cell according to claim 5, wherein the tunneling dielectric layer abuts neighboring sidewall surfaces of the erase gate and the floating gate, and abuts neighboring sidewall surfaces of the erase gate and the sidewall spacer.

7. The split-gate flash memory cell according to claim 1, further comprising:

a word line arranged over the semiconductor substrate, laterally adjacent to the floating gate and the control gate.

17. The split-gate flash memory cell according to claim 1, wherein the concave sidewall surface defines a lateral recess in the floating gate, and wherein the lateral recess has a bowl-shaped profile.

18. The split-gate flash memory cell according to claim 1, wherein the variable width increases continuously from the top of the width-wise bulge to about even with the midpoint of the concave sidewall surface.

8. A split-gate flash memory cell, comprising:

a shared source/drain region disposed within a semiconductor substrate;

an erase gate disposed over the shared source/drain region, wherein the erase gate comprises a pair of convex sidewalls respectively on opposite sides of the erase gate, and further comprises a pair of additional sidewalls respectively on the opposite sides, wherein the additional sidewalls have line-shaped profiles and extend from a top of the erase gate respectively to the convex sidewalls, and wherein the additional sidewalls are laterally between bottom edges respectively of the convex sidewalls;

a floating gate disposed over the semiconductor substrate and having a sidewall surface laterally separated from the erase gate by a tunneling dielectric layer, wherein the floating gate has a tip that protrudes outward along the sidewall surface of the floating gate, and wherein the floating gate has another sidewall surface on an opposite side of the floating gate as the sidewall surface; and

a control gate separated from the floating gate by a control gate dielectric layer overlying the floating gate;

wherein the sidewall surface arcs continuously from a top edge of the sidewall surface to a bottom edge of the sidewall surface, and wherein the sidewall surface has a point laterally spaced between the other sidewall surface and the bottom edge.

9. The split-gate flash memory cell according to claim 8, wherein a width of the erase gate bulges below the tip.

10. The split-gate flash memory cell according to claim 8, further comprising:

a pair of sidewall spacers arranged over and partially covering the floating gate, wherein the control gate is arranged between the sidewall spacers.

11. The split-gate flash memory cell according to claim 10, wherein the control gate dielectric layer is arranged between the sidewall spacers and comprises a pair of sidewall surfaces respectfully contacting the sidewall spacers.

12. The split-gate flash memory cell according to claim 10, wherein a bottom surface of one of the sidewall spacers is higher than a bottom surface of another one of the sidewall spacers with respect to the semiconductor substrate.

13. The split-gate flash memory cell according to claim 10, wherein one of the sidewall spacers has a sidewall surface that is adjacent to the sidewall surface of the floating gate, and wherein the tunneling dielectric layer conformally lines the sidewall surface of the one of the sidewall spacers and the sidewall surface of the floating gate while contacting the erase gate.

14. A split-gate flash memory cell comprising:

a semiconductor substrate comprising a first source/drain region and a second source/drain region;

an erase gate directly over the second source/drain region, wherein the erase gate bulges along a bottom of the erase gate;

a word line and a floating gate laterally spaced between the erase gate and the first source/drain region, wherein the floating gate comprises a first sidewall surface and a second sidewall surface respectively on opposite sides of the floating gate, wherein the second sidewall surface of the floating gate neighbors the erase gate and is concave, and wherein a height of the floating gate increases laterally from the first sidewall surface of the floating gate to the second sidewall surface of the floating gate; and

a control gate over the floating gate, wherein a height of the control gate decreases laterally from the first sidewall surface of the floating gate to the second sidewall surface of the floating gate;

wherein the erase gate protrudes into the floating gate to a point spaced from and between the first sidewall surface and a bottom edge of the second sidewall surface, wherein the point is defined by a conductive sidewall surface of the erase gate, and wherein the first and second sidewall surfaces of the floating gate are conductive.

15. The split-gate flash memory cell according to claim 14, wherein the height of the floating gate is substantially uniform from the first sidewall surface of the floating gate to a location laterally spaced between the first and second sidewall surfaces of the floating gate, and wherein the height of the floating gate increases continuously from the location to the second sidewall surface of the floating gate.

16. The split-gate flash memory cell according to claim 15, wherein the second sidewall surface arcs towards an interior of the floating gate, wherein the second sidewall surface is partially covered by a sidewall spacer that is between the control gate and the erase gate, and wherein a tunneling dielectric layer conformally lines the sidewall spacer and the second sidewall surface of the floating gate.

19. The split-gate flash memory cell according to claim 14, wherein the split-gate flash memory cell further comprises:

a pair of shallow trench isolation (STI) structures, wherein the STI structures are laterally elongated in parallel and in a first direction, wherein a height of the floating gate increases from the first sidewall surface to the second sidewall surface in the first direction, wherein the floating gate is sandwiched between and adjoins the STI structures in a second direction transverse to the first direction, and wherein a top surface of the STI structure is recessed below a top surface of the floating gate.

20. The split-gate flash memory cell according to claim 14, wherein the erase gate comprises a pair of bulbous protrusions at a bottom of the erase gate, and further comprises a pair of erase gate sidewalls, wherein the bulbous protrusions are respectively on opposite sides of the erase gate, wherein the erase gate sidewalls are respectively on the opposite sides of the erase gate, wherein the erase gate sidewalls have substantially line-shaped profiles and extend from a top of the erase gate respectively to the bulbous protrusions, and wherein the bulbous protrusions protrude sideways respectively beginning at the erase gate sidewalls.