Semiconductor device and method of manufacturing the same
First Claim
1. A semiconductor device comprising:
- a semiconductor layer provided with a gate trench;
a first conductivity type source region formed to be exposed on a surface side of the semiconductor layer for forming part of a side surface of the gate trench;
a second conductivity type channel region formed on a side of the source region closer to a back surface of the semiconductor layer to be in contact with the source region for forming part of the side surface of the gate trench;
a first conductivity type drain region formed on a side of the channel region closer to the back surface of the semiconductor layer to be in contact with the channel region for forming a bottom surface of the gate trench;
a gate insulating film formed on an inner surface of the gate trench; and
a gate electrode embedded inside the gate insulating film in the gate trench, whereinthe channel region includes a channel portion formed along the side surface of the gate trench so that a channel is formed in operation, a recess portion formed from the surface side in the channel portion such that the recess portion is concaved toward the back surface side of the semiconductor layer with respect to a contact surface between the source region and the channel region and a projection projecting from an end portion of the channel portion toward the back surface of the semiconductor layer in the form of a parabola.
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Accused Products
Abstract
A semiconductor device according to the present invention includes a semiconductor layer provided with a gate trench, a first conductivity type source region formed to be exposed on a surface side of the semiconductor layer, a second conductivity type channel region formed on a side of the source region closer to a back surface of the semiconductor layer to be in contact with the source region, a first conductivity type drain region formed on a side of the channel region closer to the back surface of the semiconductor layer to be in contact with the channel region, a gate insulating film formed on an inner surface of the gate trench, and a gate electrode embedded inside the gate insulating film in the gate trench, while the channel region includes a channel portion formed along the side surface of the gate trench so that a channel is formed in operation and a projection projecting from an end portion of the channel portion closer to the back surface of the semiconductor layer toward the back surface.
17 Citations
23 Claims
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1. A semiconductor device comprising:
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a semiconductor layer provided with a gate trench; a first conductivity type source region formed to be exposed on a surface side of the semiconductor layer for forming part of a side surface of the gate trench; a second conductivity type channel region formed on a side of the source region closer to a back surface of the semiconductor layer to be in contact with the source region for forming part of the side surface of the gate trench; a first conductivity type drain region formed on a side of the channel region closer to the back surface of the semiconductor layer to be in contact with the channel region for forming a bottom surface of the gate trench; a gate insulating film formed on an inner surface of the gate trench; and a gate electrode embedded inside the gate insulating film in the gate trench, wherein the channel region includes a channel portion formed along the side surface of the gate trench so that a channel is formed in operation, a recess portion formed from the surface side in the channel portion such that the recess portion is concaved toward the back surface side of the semiconductor layer with respect to a contact surface between the source region and the channel region and a projection projecting from an end portion of the channel portion toward the back surface of the semiconductor layer in the form of a parabola. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification