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Substrate features for enhanced fluidic assembly of electronic devices

  • US 9,917,226 B1
  • Filed: 09/15/2016
  • Issued: 03/13/2018
  • Est. Priority Date: 09/15/2016
  • Status: Active Grant
First Claim
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1. A fluidic assembly system, the system comprising:

  • a substrate including a plurality of wells each having a sidewall and a first width, wherein a through hole via extends from a bottom of at least one of the plurality of wells;

    a post enhanced diode including a post having a second width and extending from a top surface of a diode structure, and wherein the diode structure has a third width; and

    wherein the first width is greater than both the second width and the third width, and wherein the post of the post enhanced diode is incapable of insertion in the through hole via.

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