Substrate features for enhanced fluidic assembly of electronic devices
First Claim
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1. A fluidic assembly system, the system comprising:
- a substrate including a plurality of wells each having a sidewall and a first width, wherein a through hole via extends from a bottom of at least one of the plurality of wells;
a post enhanced diode including a post having a second width and extending from a top surface of a diode structure, and wherein the diode structure has a third width; and
wherein the first width is greater than both the second width and the third width, and wherein the post of the post enhanced diode is incapable of insertion in the through hole via.
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Abstract
Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate. In some cases, embodiments include a substrate including a plurality of wells each having a sidewall where a through hole via extends from a bottom of at least one of the plurality of wells; and a post enhanced diode including a post extending from a top surface of a diode structure.
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Citations
20 Claims
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1. A fluidic assembly system, the system comprising:
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a substrate including a plurality of wells each having a sidewall and a first width, wherein a through hole via extends from a bottom of at least one of the plurality of wells; a post enhanced diode including a post having a second width and extending from a top surface of a diode structure, and wherein the diode structure has a third width; and wherein the first width is greater than both the second width and the third width, and wherein the post of the post enhanced diode is incapable of insertion in the through hole via. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A fluidic assembly system, the system comprising:
a substrate including a plurality of polygonal wells, wherein each of the polygonal wells have a sidewall defining an outer perimeter of the respective polygonal well and extending from one surface of the substrate to a well bottom, wherein the outer perimeter is a polygon shape, and wherein each of the polygonal wells is sized to accept a single disk shaped device. - View Dependent Claims (13, 14)
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15. A method for forming a fluidic assembly substrate, the method comprising:
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receiving a post dimension of a post enhanced diode; providing a substrate material having a top surface and a bottom surface; forming a plurality of wells in the substrate material, wherein each of the plurality of wells extends only partially into the substrate material, wherein a through hole via extends from a bottom of at least one of the plurality of wells through to the bottom surface of the substrate material; and
wherein the through hole via is formed based upon the post dimension such that a post of the post enhanced diode is incapable of insertion into the through hole via. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification