×

Multilevel driver for high speed chip-to-chip communications

  • US 9,917,711 B2
  • Filed: 01/09/2017
  • Issued: 03/13/2018
  • Est. Priority Date: 06/25/2014
  • Status: Active Grant
First Claim
Patent Images

1. An apparatus comprising:

  • a plurality of driver slices arranged in parallel, each driver slice having a digital driver input and a slice output, each driver slice configured to generate a signal at a signal level determined by the digital driver input, and wherein each driver slice comprises;

    a plurality of resistive elements having a first and a second end, the first end of each of the resistive elements being connected to the driver slice output; and

    ,for each resistive element, a voltage switching circuit connected to the second end of the resistive element, the voltage switching circuit configured to selectively couple the second end of the resistive element to a respective constant-voltage node in a group of at least two constant-voltage nodes, the voltage switching circuit being controlled by the digital driver input; and

    ,a common output node connected to (i) the plurality of driver slice outputs, (ii) a wire of a multi-wire bus.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×